Patents by Inventor Kiyoshi Mita
Kiyoshi Mita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7728438Abstract: An optical semiconductor device of which the moisture resistance and the like are improved and the manufacturing method thereof are provided. An optical semiconductor device of the embodiment is configured to include an optical semiconductor element on a surface of which a circuit portion including a light-receiving or light-emitting element is formed; a terminal portion which is provided on a back of the optical semiconductor element and electrically connected with the circuit portion; a covering layer which covers the surface of the optical semiconductor element and is made of a transparent material; and sealing resin which covers side faces of the covering layer and of the optical semiconductor element. The circuit portion and the terminal portion may be connected by a rewiring pattern.Type: GrantFiled: September 29, 2006Date of Patent: June 1, 2010Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Koujiro Kameyama, Kiyoshi Mita
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Patent number: 7566588Abstract: To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor element 14, having a light receiving part or a light emitting part, is sealed in a sealing resin 13, a cover layer 12, covering the top surface of optical semiconductor element 14, is exposed from the top surface of sealing resin 13. Thus in comparison to a related-art example with which the entirety is sealed by a transparent resin, sealing resin 13 can be formed thinly and the thickness of the entire device can be made thin. Furthermore, semiconductor device 10 is arranged using a sealing resin having a filler mixed in. A semiconductor device that is excellent in mechanical strength and humidity resistance can thus be arranged.Type: GrantFiled: October 13, 2006Date of Patent: July 28, 2009Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Koujiro Kameyama, Kiyoshi Mita
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Patent number: 7432580Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.Type: GrantFiled: December 20, 2005Date of Patent: October 7, 2008Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Kazunari Kurokawa, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta, Tetsuro Sawai, Toshikazu Imaoka
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Patent number: 7365628Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.Type: GrantFiled: January 24, 2006Date of Patent: April 29, 2008Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta
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Patent number: 7264997Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.Type: GrantFiled: July 16, 2004Date of Patent: September 4, 2007Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Koujiro Kameyama, Kiyoshi Mita
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Patent number: 7213333Abstract: Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for manufacturing a mounting substrate includes the steps of: forming a plurality of electrodes to a mounting substrate, the plurality of electrodes being electrically connected to each other by use of plating wires; energizing the electrodes via the plating wires to coat the electrodes with plated films 19 by electroplating; and electrically separating the individual electrodes from each other by cutting off the plating wires. Furthermore, the method for manufacturing a circuit device includes, in addition to the foregoing method for manufacturing a mounting substrate, the steps of: fixing a circuit element on the mounting substrate and electrically connecting the electrodes with the circuit element; and forming a sealing resin so as to cover the circuit element.Type: GrantFiled: March 31, 2004Date of Patent: May 8, 2007Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventor: Kiyoshi Mita
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Publication number: 20070069232Abstract: To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor element 14, having a light receiving part or a light emitting part, is sealed in a sealing resin 13, a cover layer 12, covering the top surface of optical semiconductor element 14, is exposed from the top surface of sealing resin 13. Thus in comparison to a related-art example with which the entirety is sealed by a transparent resin, sealing resin 13 can be formed thinly and the thickness of the entire device can be made thin. Furthermore, semiconductor device 10 is arranged using a sealing resin having a filler mixed in. A semiconductor device that is excellent in mechanical strength and humidity resistance can thus be arranged.Type: ApplicationFiled: October 13, 2006Publication date: March 29, 2007Inventors: Koujiro Kameyama, Kiyoshi Mita
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Patent number: 7183589Abstract: To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor element 14, having a light receiving part or a light emitting part, is sealed in a sealing resin 13, a cover layer 12, covering the top surface of optical semiconductor element 14, is exposed from the top surface of sealing resin 13. Thus in comparison to a related-art example with which the entirety is sealed by a transparent resin, sealing resin 13 can be formed thinly and the thickness of the entire device can be made thin. Furthermore, semiconductor device 10 is arranged using a sealing resin having a filler mixed in. A semiconductor device that is excellent in mechanical strength and humidity resistance can thus be arranged.Type: GrantFiled: February 26, 2004Date of Patent: February 27, 2007Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Koujiro Kameyama, Kiyoshi Mita
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Publication number: 20070034995Abstract: An optical semiconductor device of which the moisture resistance and the like are improved and the manufacturing method thereof are provided. An optical semiconductor device of the embodiment is configured to include an optical semiconductor element on a surface of which a circuit portion including a light-receiving or light-emitting element is formed; a terminal portion which is provided on a back of the optical semiconductor element and electrically connected with the circuit portion; a covering layer which covers the surface of the optical semiconductor element and is made of a transparent material; and sealing resin which covers side faces of the covering layer and of the optical semiconductor element. The circuit portion and the terminal portion may be connected by a rewiring pattern.Type: ApplicationFiled: September 29, 2006Publication date: February 15, 2007Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Koujiro Kameyama, Kiyoshi Mita
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Publication number: 20060176137Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.Type: ApplicationFiled: January 24, 2006Publication date: August 10, 2006Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta
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Publication number: 20060131724Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.Type: ApplicationFiled: December 20, 2005Publication date: June 22, 2006Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Kazunari Kurokawa, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta, Tetsuro Sawai, Toshikazu Imaoka
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Patent number: 7056768Abstract: A cutting method for separating individual semiconductor devices by cutting boundary portions in a group of semiconductor devices made up by arranging a plurality of semiconductor devices in which a ductile first layer and a second layer are stacked on a peripheral side thereof, the cutting method comprises a cutting step of cutting the first and second layers by moving a first rotary body from the boundary portions of the group of semiconductor devices in the direction in which the first and second layers are stacked; and a burr removal step of removing burrs from the first layer by moving a second rotary body, softer than the first rotary body and wider than the first rotary body in the direction of rotational axis, from the cut boundary portions of the group of semiconductor devices in the direction in which the first and second layers are stacked.Type: GrantFiled: July 16, 2004Date of Patent: June 6, 2006Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., LtdInventors: Koujiro Kameyama, Kiyoshi Mita
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Patent number: 6987030Abstract: The method of manufacturing the semiconductor device includes the steps of forming terminal portions convexly protruding on a surface of first conductive foil by etching the first conductive foil except portions to become terminals, superimposing a resin sheet on the first conductive foil such that the terminal portions are embedded in the resin sheet, constructing a laminated sheet by superimposing second conductive foil having a resin layer formed on a back thereof, on the resin sheet with the resin layer faced down, forming a conductive pattern by etching the second conductive foil, electrically connecting the conductive pattern and the terminal portions, electrically isolating the terminal portions from each other, firmly fixing a semiconductor element to the laminated sheet and electrically connecting the semiconductor element and the conductive pattern, and forming sealing resin on a surface of the laminated sheet such that the semiconductor element is covered by the sealing resin.Type: GrantFiled: March 31, 2004Date of Patent: January 17, 2006Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventor: Kiyoshi Mita
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Publication number: 20050012193Abstract: A cutting method for separating individual semiconductor devices by cutting boundary portions in a group of semiconductor devices made up by arranging a plurality of semiconductor devices in which a ductile first layer and a second layer are stacked on a peripheral side thereof, the cutting method comprises a cutting step of cutting the first and second layers by moving a first rotary body from the boundary portions of the group of semiconductor devices in the direction in which the first and second layers are stacked; and a burr removal step of removing burrs from the first layer by moving a second rotary body, softer than the first rotary body and wider than the first rotary body in the direction of rotational axis, from the cut boundary portions of the group of semiconductor devices in the direction in which the first and second layers are stacked.Type: ApplicationFiled: July 16, 2004Publication date: January 20, 2005Inventors: Koujiro Kameyama, Kiyoshi Mita
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Publication number: 20050012187Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.Type: ApplicationFiled: July 16, 2004Publication date: January 20, 2005Inventors: Koujiro Kameyama, Kiyoshi Mita
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Publication number: 20040253769Abstract: The method of manufacturing the semiconductor device includes the steps of forming terminal portions convexly protruding on a surface of first conductive foil by etching the first conductive foil except portions to become terminals, superimposing a resin sheet on the first conductive foil such that the terminal portions are embedded in the resin sheet, constructing a laminated sheet by superimposing second conductive foil having a resin layer formed on a back thereof, on the resin sheet with the resin layer faced down, forming a conductive pattern by etching the second conductive foil, electrically connecting the conductive pattern and the terminal portions, electrically isolating the terminal portions from each other, firmly fixing a semiconductor element to the laminated sheet and electrically connecting the semiconductor element and the conductive pattern, and forming sealing resin on a surface of the laminated sheet such that the semiconductor element is covered by the sealing resin.Type: ApplicationFiled: March 31, 2004Publication date: December 16, 2004Inventor: Kiyoshi Mita
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Publication number: 20040245530Abstract: An optical semiconductor device of which the moisture resistance and the like are improved and the manufacturing method thereof are provided. An optical semiconductor device of the embodiment is configured to include an optical semiconductor element on a surface of which a circuit portion including a light-receiving or light-emitting element is formed; a terminal portion which is provided on a back of the optical semiconductor element and electrically connected with the circuit portion; a covering layer which covers the surface of the optical semiconductor element and is made of a transparent material; and sealing resin which covers side faces of the covering layer and of the optical semiconductor element. The circuit portion and the terminal portion may be connected by a rewiring pattern.Type: ApplicationFiled: March 30, 2004Publication date: December 9, 2004Inventors: Koujiro Kameyama, Kiyoshi Mita
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Publication number: 20040232566Abstract: To provide a semiconductor device with increased reliability between a mounting substrate and sealing resin and a method of manufacturing the same. The semiconductor device includes a mounting substrate including a step portion in the periphery; first and second conductive patterns formed on the front and back surfaces of the mounting substrate, respectively; a semiconductor element fixed to the mounting substrate and electrically connected to the first conductive patterns; and sealing resin covering the front surface of the mounting substrate and the step portion and seals the semiconductor element.Type: ApplicationFiled: March 31, 2004Publication date: November 25, 2004Inventor: Kiyoshi Mita
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Publication number: 20040226828Abstract: Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for manufacturing a mounting substrateincludes the steps of: forming a plurality of electrodes to a mounting substrate, the plurality of electrodes being electrically connected to each other by use of plating wires; energizing the electrodes via the plating wires to coat the electrodes with plated films 19 by electroplating; and electrically separating the individual electrodes from each other by cutting off the plating wires. Furthermore, the method for manufacturing a circuit device includes, in addition to the foregoing method for manufacturing a mounting substrate, the steps of: fixing a circuit element on the mounting substrate and electrically connecting the electrodes with the circuit element; and forming a sealing resin so as to cover the circuit element.Type: ApplicationFiled: March 31, 2004Publication date: November 18, 2004Inventor: Kiyoshi Mita
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Publication number: 20040188699Abstract: To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor element 14, having a light receiving part or a light emitting part, is sealed in a sealing resin 13, a cover layer 12, covering the top surface of optical semiconductor element 14, is exposed from the top surface of sealing resin 13. Thus in comparison to a related-art example with which the entirety is sealed by a transparent resin, sealing resin 13 can be formed thinly and the thickness of the entire device can be made thin. Furthermore, semiconductor device 10 is arranged using a sealing resin having a filler mixed in. A semiconductor device that is excellent in mechanical strength and humidity resistance can thus be arranged.Type: ApplicationFiled: February 26, 2004Publication date: September 30, 2004Inventors: Koujiro Kameyama, Kiyoshi Mita