Abstract: A method for forming a ceramic laminate ceramic laminate from first and second sheets of ceramic material, the sheets having a first and a second surface, wherein the first ceramic material has a different coefficient of thermal expansion than the second ceramic material and the outer layers comprises ceramic materials having substantially the same thermal properties, comprising (a) heating the first and the second sheets of ceramic material; (b) stacking the first and the second sheets of ceramic material wherein the second surfaces are opposed to one another to provide stacked sheets; and (c) pressing the stacked sheets and forming the ceramic laminate.

Abstract: A low temperature sintering ceramic composition can be sintered at 850 to 1,000° C., and the sintered ceramic has a low dielectric constant (9 or less at 16 Ghz or more) and a high Qf (10,000 or more). The composition can be co-sintered with wiring material containing Ag, Au, or Cu. The ceramic composition includes (by mass) CaO, MgO, and SiO2 in total: over 60% to 98.6%; Bi2O3: from 1% to under 35%; and Li2O: from 0.4% to under 6%; wherein (CaO+MgO) and SiO2 are contained in the molar ratio of from 1:1 to under 1:2.5.

Abstract: A low temperature sintering ceramic composition that can be sintered at a temperature equal to or less than 1000° C. and has low dielectric constant and dielectric loss in a high frequency region of 17 Ghz or more, an electronic component using the same and a method of fabricating the low temperature sintering ceramic are provided. The composition comprises MgO and SiO2 in sum total in the range of from 64.0 to 99.2% by mass; Bi2O3 in the range of from 0.4 to 33.0% by mass; Li2O in the range of from 0.4 to 3.0% by mass; and MgO and SiO2 are contained in the molar ratio of from 2:1 to 2:3.5, at least part thereof being contained as a complex oxide of Mg and Si.

Abstract: A low temperature sintering ceramic composition can be sintered at 850 to 1,000° C., and the sintered ceramic has a low dielectric constant (9 or less at 16 Ghz or more) and a high Qf (10,000 or more). The composition can be co-sintered with wiring material containing Ag, Au, or Cu. The ceramic composition includes (by mass) CaO, MgO, and SiO2 in total: over 60% to 98.6%; Bi2O3: from 1% to under 35%; and Li2O: from 0.4% to under 6%; wherein (CaO+MgO) and SiO2 are contained in the molar ratio of from 1:1 to under 1:2.5.

Abstract: A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Abstract: A low temperature sintering ceramic composition that can be sintered at a temperature equal to or less than 1000° C. and has low dielectric constant and dielectric loss in a high frequency region of 17 Ghz or more, an electronic component using the same and a method of fabricating the low temperature sintering ceramic are provided. The composition comprises MgO and SiO2 in sum total in the range of from 64.0 to 99.2% by mass; Bi2O3 in the range of from 0.4 to 33.0% by mass; Li2O in the range of from 0.4 to 3.0% by mass; and MgO and SiO2 are contained in the molar ratio of from 2:1 to 2:3.5, at least part thereof being contained as a complex oxide of Mg and Si.

Abstract: A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Abstract: A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Abstract: A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Abstract: A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Abstract: A ball-grid-array-type semiconductor device comprising a package substrate constituted with a ceramic wiring board having a semiconductor chip mounting portion on the principal plane and electrodes arranged like an array on the back, a semiconductor chip secured to the principal plane of the package substrate, connection means for electrically connecting the electrodes of the semiconductor chip with the wiring of the wiring board, a sealing body provided for the principal plane side of the wiring board and made of an insulating resin to cover the semiconductor chip and the connection means, a pedestal layer made of low-fusion-point solder and formed on the electrodes, and a metallic ball secured onto the pedestal layer; wherein a buffering layer made of high-fusion-point solder which covers the entire surface of the electrodes and whose margin extends up to a predetermined length on the back of the package substrate is formed on the electrodes and the pedestal layer is formed on the buffering layer.

Abstract: Carbon black having silica attached to the surface, characterized in that the attached silica has a size of from 0.1 to 20 nm in thickness and from 1 to 40 nm in width.

Abstract: A process for fabricating an electronic component having a hollow packaging structure comprises the steps of: (a) printing an organic polymeric material on at least a portion of a main surface of a ceramic substrate where a ceramic lid is to be bonded and curing the printed organic polymeric material to form a cured product; (c) hermetic sealing the ceramic lid on a surface of the cured product with an organic bonding agent; and preferably (b) irradiating ultraviolet rays onto a surface of said cured product to form activated bonding sites between said steps (a) and (c). According to the process, a hollow package mounted with an electronic component can be fabricated efficiently.

Abstract: The exothermic instrument for firing an explosive comprises a circuit board 1 having a heat resist layer 6 on a substrate 11 and an exothermic resistance 4, which connects to a pair of through hole conductive electrodes 13 passing through the substrate 11, contacting with the explosive 19 on the heat resist layer 6, a pair of electrode pins 8, each one thereof is inserted into each one of the through hole conductive electrodes, and an insulator for holding the circuit board 1 through which the electrode pins 8 pass.

Abstract: A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.

Abstract: A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.

Abstract: An additive for stock feeds containing decomposition products of chicory roots in which the total content of polysaccharides and inulooligosaccharides of tri- and higher saccharides obtained by decomposing the chicory roots is 40% by weight or more of the total solids content and is 80% by weight or more of the total saccharides. The stock feed preferably contains 0.1 to 10% by weight of the additive. The additive is prepared by a process which comprises the steps of chopping and then heating/drying chicory roots in order to form chicory flakes, and grinding the chicory flakes, or by a process which comprises the step of enzymatically decomposing the chicory roots without an extraction step.

Abstract: An additive for stock feeds containing decomposition products of chicory roots in which the total content of polysaccharides and inulooligosaccharides of tri- and higher saccharides obtained by decomposing the chicory roots is 40% by weight or more of the total solids content and is 80% by weight or more of the total saccharides. The stock feed preferably contains 0.1 to 10% by weight of the additive. The additive is prepared by a process which comprises the steps of chopping and then heating/drying chicory roots in order to form chicory flakes, and grinding the chicory flakes, or by a process which comprises the step of enzymatically decomposing the chicory roots without an extraction step.

Abstract: A heat-resistant silicone rubber is obtained from a composition of a vinyl-containing polyorganosiloxane, a hydrogenpolyorganosiloxane, a platinum-containing catalyst, carbon black, and an acetylacetone salt of a metal wherein the metal can be copper, zinc, aluminum, iron, cerium, zirconium, or titanium. The silicone rubber can maintain its rubber properties at temperatures of 350.degree. C. for prolonged periods of time.

Abstract: In a method of tension stress testing of rubber of the type wherein a rubber sample is elongated continuously at a predetermined speed and the tension stress is measured when the distance between a pair of reference positions set on the surface of the sample shows a predetermined elongation, prior to the actual test, a plurality of rubber samples having different hardness are elongated continuously under predetermined tension test conditions, the tension stress measuring time between the time of commencing the continuous elongation and a time at which the distance between the reference positions is measured, and by utilizing the data thus obtained and the data regarding the hardness of respective rubber samples, the measuring time function of the tension stress measuring time regarding the hardness is determined by a statistical method.