Abstract: A humidifier includes a housing, a humidifying rotor, and an irradiator. The housing is formed with an air passage through which air passes and a water storage tank configured to store water. The humidifying rotor extends over the air passage and the water storage tank. The humidifying rotor rotates so that a portion of the humidifying rotor having absorbed moisture from the water storage tank moves to the air passage and releases the moisture. The irradiator irradiates part of the humidifying rotor with ultraviolet light.

Abstract: An ultraviolet ray radiation apparatus includes a light emitter, a light receiver, and a protector. The light emitter emits ultraviolet light. The light receiver outputs a signal varying with an amount of light received. The protector protects the light receiver from ultraviolet light.

Abstract: An air-conditioning apparatus includes an irradiation device including an LED configured to emit an ultraviolet ray; and includes a heat-dissipating unit configured to dissipate heat of the irradiation device into air.

Abstract: An output content generation device, includes: a first calculation unit that calculates a size, in a display region of a display device, of each of pieces of information to be displayed in the display region; a determination unit that determines whether or not the pieces of information are arrangeable in the display region, based on the size of each of the pieces of information and a size of the display region; and a generation unit that allocates the pieces of information in a plurality of screens accommodated in the display region in a distributed manner, and generates output content of the pieces of information, when the pieces of information are not arrangeable in the display region, thereby enabling information to be legibly viewable.

Abstract: An object is to provide a graphite-copper composite electrode material that is capable of reducing electrode wear to a practically usable level and to provide an electrical discharge machining electrode using the material. A graphite-copper composite electrode material includes a substrate comprising a graphite material and having pores, and copper impregnated in the pores of the substrate, the electrode material having an electrical resistivity of 2.5 ??m or less, preferably 1.5 ??m or less, more preferably 1.0 ??m or less. It is desirable that the substrate comprising the graphite material have an anisotropy ratio of 1.2 or less. It is desirable that an impregnation rate ? of the copper in the electrode material is 13% or greater. It is desirable that the substrate comprising the graphite material have a bulk density of from 1.40 Mg/m3 to 1.85 Mg/m3.

Abstract: [Problem to be Solved] To provide a gas humidity regulating method and a regulator that can regulate a temperature during humidity control and improve humidity-control efficiency. In an air humidity regulating method for gas subjected to treatment, a first medium 22 is caused to flow onto a heat exchanging pipe 17 of a gas-liquid contact part 18 in a dehumidifier 11; meanwhile, a second medium 24 is passed through the heat exchanging pipe 17. In this state, air is fed into a gas-liquid contact case 13 from an inlet port 14 and gas-liquid contact is made by the first medium 22 on the gas-liquid contact part 18 so as to absorb water content from the air into the first medium 22. The first medium 22 contains an ionic liquid having high absorbency. The temperature of the first medium 22 is regulated by the second medium 24. After that, treated air is discharged from an outlet port 15 of the gas-liquid contact case 13.

Abstract: An object is to provide a graphite-copper composite electrode material that is capable of reducing electrode wear to a practically usable level and to provide an electrical discharge machining electrode using the material. A graphite-copper composite electrode material includes a substrate comprising a graphite material and having pores, and copper impregnated in the pores of the substrate, the electrode material having an electrical resistivity of 2.5 ??m or less, preferably 1.5 ??m or less, more preferably 1.0 ??m or less. It is desirable that the substrate comprising the graphite material have an anisotropy ratio of 1.2 or less. It is desirable that an impregnation rate ? of the copper in the electrode material is 13% or greater. It is desirable that the substrate comprising the graphite material have a bulk density of from 1.40 Mg/m3 to 1.85 Mg/m3.

Abstract: A composite shaped product of the present invention is a joined body which is excellent in shock resistance, and which includes shaped products (B1) and (B2) which contain a carbon fiber and a thermoplastic resin, in which the shaped products (B1) and (B2) are disposed on both sides of a composite substrate (A) that contains a continuous fiber such as a polyester fiber and a thermoplastic resin so that the composite substrate (A) is interposed between the shaped products (B1) and (B2), and the shaped products (B1) and (B2) are heat-welded to each other at a joining portion (C) through a through hole (D1) of the composite substrate (A).

Abstract: A method of obtaining a high-strength bonded body between composite materials, each containing a thermoplastic resin and carbon fibers, with a low current in a short period of time, wherein the bonded body is rarely susceptible to deformation such as warp. The method of manufacturing a bonded body, comprises the steps of: (i) preparing a plurality of composite materials, each containing a thermoplastic resin and discontinuous carbon fibers which are randomly oriented; (ii) overlapping the composite materials each other; (iii) sandwiching at least a part of the overlapped portion between a pair of electrodes; and (iv) applying electricity between the electrodes to weld together the thermoplastic resins with Joule heat.

Abstract: A composite shaped product of the present invention is a joined body which is excellent in shock resistance, and which includes shaped products (B1) and (B2) which contain a carbon fiber and a thermoplastic resin, in which the shaped products (B1) and (B2) are disposed on both sides of a composite substrate (A) that contains a continuous fiber such as a polyester fiber and a thermoplastic resin so that the composite substrate (A) is interposed between the shaped products (B1) and (B2), and the shaped products (B1) and (B2) are heat-welded to each other at a joining portion (C) through a through hole (D1) of the composite substrate (A).

Abstract: The problem of the present invention is to provide, in high current-low energy type ion implantation apparatuses, a graphite member for a beam line inner member of an ion implantation apparatus, which graphite member can markedly reduce particles incorporated in a wafer surface. This problem can be solved by the graphite member of the present invention, which is a graphite member for a beam line inner member of an ion implantation apparatus, which member having a bulk density of not less than 1.80 Mg/m3 and an electric resistivity of not more than 9.5 ??·m. Preferably, the R value obtained by dividing D band intensity at 1370 cm?1 by G band intensity at 1570 cm?1 in the Raman spectrum of a spontaneous fracture surface of the graphite member is not more than 0.20.

Abstract: This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

Abstract: This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

Abstract: An underwater foundation leveling device is capable of preventing a slack wire connected to a support element with a plumb weight from colliding with reflectors. The reflectors 5 are provided for measurement of a position of a leveling area, around an upper portion of the support element 2 supporting the plumb weight for leveling riprap surface of underwater foundation. The support element is hoisted with the wire 4 and then made fall by its own weight for leveling for the foundation surface. The reflectors reflect light toward a light receiving unit for a position detection for the leveling area. The device comprises, a protective element 8 preventing the slack wire 4 from hitting the reflectors, and a light passage located in a position allowing an optical path of the light reflected from the reflectors to travel toward the light receiving unit.

Abstract: This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

Abstract: This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.

Abstract: An underwater foundation leveling device is capable of preventing a slack wire connected to a support element with a plumb weight from colliding with reflectors. The reflectors 5 are provided for measurement of a position of a leveling area, around an upper portion of the support element 2 supporting the plumb weight for leveling riprap surface of underwater foundation. The support element is hoisted with the wire 4 and then made fall by its own weight for leveling for the foundation surface. The reflectors reflect light toward a light receiving unit for a position detection for the leveling area. The device comprises, a protective element 8 preventing the slack wire 4 from hitting the reflectors, and a light passage located in a position allowing an optical path of the light reflected from the reflectors to travel toward the light receiving unit.

Abstract: A particulate filter is provided in an exhaust system of the engine. Parameter values correlated with a flow amount of exhaust gas of the engine are determined, and differential pressure between upstream and downstream sides of the particulate filter is determined. The ratio of a variation rate of the parameter values correlated with the exhaust flow amount to a variation rate of the differential pressure is compared with a predetermined threshold value during transitional operation of the engine to determine the state of the particulate filter.

Abstract: Deterioration of a catalyst provided in an exhaust system of the engine is determined. Air-fuel ratio sensors are provided in the upstream side and the downstream side of the catalyst. Air-fuel ratio is changed. Based on the sensor outputs in the upstream die and the downstream side of the catalyst, a parameter of a catalyst model representing a state of the catalyst is identified. The parameter is compared with a threshold to determine a state of the catalyst.

Abstract: An exhaust gas purifying apparatus for an internal combustion engine including a first filter and a second filter. The first filter traps particulates in exhaust gases from said engine. The second filter is provided for failure detection and disposed downstream of the first filter. The trapping state of the second filter is detected and a filtering capability of the first filter is diagnosed based on the detect trapping state of the first filter.