Patents by Inventor Kiyoshi Yajima

Kiyoshi Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050237934
    Abstract: Disclosed is an information distribution system capable of distributing high quality data without lowering throughput of a network even in a communication area where many movable bodies could be traveling. The information distribution system comprises a radio transmission unit for transmitting data signals at a transmission rate being variable; a detection unit for detecting speed control information for a mobile object having a receiver for receiving data signals transmitted without wires from the radio transmission unit; and a transmission rate setting unit for changing the transmission rate of the data signals according to the speed control information.
    Type: Application
    Filed: April 18, 2005
    Publication date: October 27, 2005
    Inventors: Kenji Mito, Toshiaki Tsuchiya, Kiyoshi Yajima, Tomoyuki Fujieda, Kazuyoshi Takahashi
  • Publication number: 20050226158
    Abstract: Disclosed is an information distribution system in which a receiving terminal installed in a mobile object can reliably receive high quality distribution information from the beginning. The information distribution system comprises data transmission units, each for transmitting a plurality of data signals including same distribution information using a plurality of different radio channels with sequentially delaying the transmission start time of the data signals; an auxiliary transmission unit for transmitting signals according to communication status of the data transmission units; a communication control unit for controlling the auxiliary transmission unit and the data transmission units; and detection means for detecting the velocity control information for the mobile object. A receiving terminal for receiving the data signals transmitted from the data transmission units is installed on the mobile object.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 13, 2005
    Inventors: Kazuyoshi Takahashi, Toshiaki Tsuchiya, Kenji Mito, Kiyoshi Yajima, Tomoyuki Fujieda
  • Publication number: 20050003577
    Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 ?m or thicker. A semiconductor device made by this method and a wafer for use with this method.
    Type: Application
    Filed: June 10, 2004
    Publication date: January 6, 2005
    Inventors: Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae
  • Publication number: 20040227386
    Abstract: A detachable seat for a vehicle, includes a seat cushion, a seat leg mechanism for supporting the seat cushion, the seat leg mechanism including a base member on which the seat cushion is carried, and first and second spaced apart leg members pivotally connected to the base member, a seat back pivotally mounted to the base member of the seat leg mechanism, a first cooperating mechanism on the first and second leg members and a vehicle floor for causing the seat to be releasably locked with the vehicle floor, and a second cooperating mechanism on the base member and the seat cushion for causing the seat cushion to be removably or detachably mounted with respect to the base member.
    Type: Application
    Filed: May 14, 2004
    Publication date: November 18, 2004
    Inventors: Toshiyuki Tsujibayashi, Kiyoshi Yajima, Tamotsu Oishi, Koji Kamida
  • Patent number: 6774496
    Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: August 10, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae
  • Patent number: 6716674
    Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.
    Type: Grant
    Filed: September 11, 2001
    Date of Patent: April 6, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae
  • Publication number: 20030153121
    Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.
    Type: Application
    Filed: March 18, 2003
    Publication date: August 14, 2003
    Applicant: Texas Instruments Incorporated
    Inventors: Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae
  • Publication number: 20030049883
    Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.
    Type: Application
    Filed: September 11, 2001
    Publication date: March 13, 2003
    Inventors: Kiyoshi Yajima, Mutsumi Masumoto, Chihiro Hatano, Kimitaka Nishio, Noriyuki Kirikae
  • Patent number: 6519344
    Abstract: There is provided an audio system which suppresses standing waves. An audio signal source (1) outputs audio signals (SR) and (SL) which are then supplied to reproducing loudspeakers (3) and (4),installed in a room (2), where the reproduced sounds are outputted. Furthermore, the audio signals (SR) and (SL) are added at an adder (9) to obtain signal (S2) which is in turn filtered by a compensating filter and then inverted by means of an inverting circuit (13). This generates a compensation signal (Sc) with a phase opposite to that of the standing wave. The compensation signal (Sc) is supplied to a compensating loudspeaker (5) installed in the room (2), whereby sound for canceling out the standing wave is outputted. The compensating filter has its frequency characteristics set in accordance with the cross-correlation function between a transfer function from the reproducing loudspeakers, (3) and (4), to a listening location and a transfer function from the compensating loudspeaker (5) to the listening location.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: February 11, 2003
    Assignee: Pioneer Corporation
    Inventors: Kiyoshi Yajima, Satoshi Kumada
  • Publication number: 20020177411
    Abstract: There is provided a Bluetooth apparatus which can be easily associated with a Bluetooth device address (BD-ADDR) in a Piconet. When a Bluetooth master apparatus selects a Bluetooth slave apparatus to be connected, the selected apparatus is clearly indicated by a selection notifying operation performed by the slave apparatus using a display or sound. When each slave apparatus has an identification number which is unique and well known, the number is returned to the master. The master apparatus registers such a number in association with a BD-ADDR.
    Type: Application
    Filed: May 22, 2002
    Publication date: November 28, 2002
    Applicant: Pioneer Corporation
    Inventors: Kiyoshi Yajima, Toshihiro Sotomaru
  • Publication number: 20020042712
    Abstract: At the time of the speaker adaptation, first feature vector generation sections (7, 8, 9) generate a feature vector series [ci, M] from which the additive noise and multiplicative noise are removed. A second feature vector generation section (12) generates a feature vector series [si, M] including the features of the additive noise and multiplicative noise. A path search section (10) conducts a path search by comparing the feature vector series [ci, M] to the standard vector [an, M] of the standard voice HMM (300). When the speaker adaptation section (11) conducts correlation operation on an average feature vector [sn, M] of the standard vector [an, M] corresponding to the path search result Dv and the feature vector series [si, M], the adaptive vector [xn, M] is generated. The adaptive vector [xn, M] updates the feature vector of the speaker adaptive acoustic model (400) used for the voice recognition.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 11, 2002
    Applicant: Pioneer Corporation
    Inventors: Kiyoshi Yajima, Soichi Toyama
  • Patent number: 6232661
    Abstract: The purpose is to improve the assembly reliability of the BGA package. The present invention provides a type of BGA semiconductor device having plural conductor bumps arranged two-dimensionally on one surface of the insulating substrate. In this semiconductor device, there is adhesive layer (8) for attaching semiconductor chip (2) to said insulating substrate (3). According to the present invention, the outer edge of said adhesive layer (8) extends beyond the outer edge of said semiconductor chip (2).
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: May 15, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Masazumi Amagai, Norihito Umehara, Kiyoshi Yajima
  • Patent number: 5192940
    Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.
    Type: Grant
    Filed: December 31, 1990
    Date of Patent: March 9, 1993
    Assignees: Fujikura, Ltd., Calsonic Corp., Kohwa Mfg. Co.
    Inventors: Kiyoshi Yajima, Takao Suzuki, Masanori Itoh, Hitoshi Okuyama, Ken-ichi Uruga, Hisanaga Hirabayashi
  • Patent number: 5000662
    Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.
    Type: Grant
    Filed: October 5, 1989
    Date of Patent: March 19, 1991
    Assignees: Fujikura, Ltd., Calsonic Corporation, Kohwa Manufacturing Co., Ltd.
    Inventors: Shuko Yamamoto, Hisanaga Hirabayashi, Kiyoshi Yajima, Takao Suzuki, Masanori Itoh, Hitoshi Okuyama, Ken-ichi Uruga
  • Patent number: D317024
    Type: Grant
    Filed: July 5, 1989
    Date of Patent: May 21, 1991
    Assignee: Kabushiki Kaisha Tamiya Mokei
    Inventor: Kiyoshi Yajima