Abstract: An underfloor storage structure for a vehicle comprises a floor panel (5) which includes a concave portion as a storage space (6), and which partially covers a port (7) of the storage space, a rotatable tray (36) disposed in the storage space (6), and at least one lid (8) for selectively closing the remaining portion of the port (7) of the storage space (6). A passenger seated in one of seats (2, 3) of the vehicle can freely and easily access pieces of luggage stored in the storage space (6) by rotating the rotatable tray (36).

Abstract: Disclosed is an information distribution system in which a receiving terminal installed in a mobile object can reliably receive high quality distribution information from the beginning. The information distribution system comprises data transmission units, each for transmitting a plurality of data signals including same distribution information using a plurality of different radio channels with sequentially delaying the transmission start time of the data signals; an auxiliary transmission unit for transmitting signals according to communication status of the data transmission units; a communication control unit for controlling the auxiliary transmission unit and the data transmission units; and detection means for detecting the velocity control information for the mobile object. A receiving terminal for receiving the data signals transmitted from the data transmission units is installed on the mobile object.

Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 ?m or thicker. A semiconductor device made by this method and a wafer for use with this method.

Abstract: A detachable seat for a vehicle, includes a seat cushion, a seat leg mechanism for supporting the seat cushion, the seat leg mechanism including a base member on which the seat cushion is carried, and first and second spaced apart leg members pivotally connected to the base member, a seat back pivotally mounted to the base member of the seat leg mechanism, a first cooperating mechanism on the first and second leg members and a vehicle floor for causing the seat to be releasably locked with the vehicle floor, and a second cooperating mechanism on the base member and the seat cushion for causing the seat cushion to be removably or detachably mounted with respect to the base member.

Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.

Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.

Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.

Abstract: A semiconductor package production method containing a step in which a bond layer made of a single-layer film thermoset bond is provided on the back of a wafer on which many semiconductor devices are formed, a dicing tape is pasted onto its bond layer side, and the bond layer and the wafer are diced simultaneously in order to obtain semiconductor devices with the bond layer, and a step in which the semiconductor devices with the bond layer are detached from the dicing tape and die-attached to interposing substrates serving as bodies to which they are bonded; wherein, the aforementioned film thermoset bond contains an epoxy resin, an epoxy resin hardener, and a phenoxy resin as well as 50-80 wt % of spherical silica, and the bond layer is 100 &mgr;m or thicker. A semiconductor device made by this method and a wafer for use with this method.

Abstract: There is provided an audio system which suppresses standing waves. An audio signal source (1) outputs audio signals (SR) and (SL) which are then supplied to reproducing loudspeakers (3) and (4),installed in a room (2), where the reproduced sounds are outputted. Furthermore, the audio signals (SR) and (SL) are added at an adder (9) to obtain signal (S2) which is in turn filtered by a compensating filter and then inverted by means of an inverting circuit (13). This generates a compensation signal (Sc) with a phase opposite to that of the standing wave. The compensation signal (Sc) is supplied to a compensating loudspeaker (5) installed in the room (2), whereby sound for canceling out the standing wave is outputted. The compensating filter has its frequency characteristics set in accordance with the cross-correlation function between a transfer function from the reproducing loudspeakers, (3) and (4), to a listening location and a transfer function from the compensating loudspeaker (5) to the listening location.

Abstract: There is provided a Bluetooth apparatus which can be easily associated with a Bluetooth device address (BD-ADDR) in a Piconet. When a Bluetooth master apparatus selects a Bluetooth slave apparatus to be connected, the selected apparatus is clearly indicated by a selection notifying operation performed by the slave apparatus using a display or sound. When each slave apparatus has an identification number which is unique and well known, the number is returned to the master. The master apparatus registers such a number in association with a BD-ADDR.

Abstract: At the time of the speaker adaptation, first feature vector generation sections (7, 8, 9) generate a feature vector series [ci, M] from which the additive noise and multiplicative noise are removed. A second feature vector generation section (12) generates a feature vector series [si, M] including the features of the additive noise and multiplicative noise. A path search section (10) conducts a path search by comparing the feature vector series [ci, M] to the standard vector [an, M] of the standard voice HMM (300). When the speaker adaptation section (11) conducts correlation operation on an average feature vector [sn, M] of the standard vector [an, M] corresponding to the path search result Dv and the feature vector series [si, M], the adaptive vector [xn, M] is generated. The adaptive vector [xn, M] updates the feature vector of the speaker adaptive acoustic model (400) used for the voice recognition.

Abstract: The purpose is to improve the assembly reliability of the BGA package. The present invention provides a type of BGA semiconductor device having plural conductor bumps arranged two-dimensionally on one surface of the insulating substrate. In this semiconductor device, there is adhesive layer (8) for attaching semiconductor chip (2) to said insulating substrate (3). According to the present invention, the outer edge of said adhesive layer (8) extends beyond the outer edge of said semiconductor chip (2).

Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.

Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.