Abstract: The present invention relates to an electrode structure, which comprises a substrate provided with an electrode formed thereon, wherein the substrate comprises a layer of a fluorine-containing polyimide and a layer of a fluorine-free resin is interposed between the polyimide layer and the electrode and, in particular, to the foregoing electrode structure, wherein the electrode comprises a gold layer as the outermost or surface layer and an aluminum layer interposed between the substrate and the gold layer. The electrode structure of the present invention never causes any peeling off of the electrode due to insufficient adhesion of the electrode to the substrate, the structure has sufficiently high strength and therefore the boundary between the substrate and the electrode formed thereon is not destroyed by the energy of ultrasonics applied thereto.

Abstract: The present invention relates to an electrode structure, which comprises a substrate provided with an electrode formed thereon, wherein the substrate comprises a layer of a fluorine-containing polyimide and a layer of a fluorine-free resin is interposed between the polyimide layer and the electrode and, in particular, to the foregoing electrode structure, wherein the electrode comprises a gold layer as the outermost or surface layer and an aluminum layer interposed between the substrate and the gold layer. The electrode structure of the present invention never causes any peeling off of the electrode due to insufficient adhesion of the electrode to the substrate, the structure has sufficiently high strength and therefore the boundary between the substrate and the electrode formed thereon is not destroyed by the energy of ultrasonics applied thereto.

Abstract: Method of controlling the baking for foods, wherein an amount of heat absorbed by a portion near the food to be baked in an oven is measured to control heating temperature and/or air flow rate in the oven, based on the measured amount of heat.

Abstract: A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing --N.dbd. and --NH.sub.2 and/or --OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.

Abstract: An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.

Abstract: An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.