Patents by Inventor Kiyoshi Yoshizaki

Kiyoshi Yoshizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6899779
    Abstract: A laminated material relatively large in thickness and having a curved surface of small radius, wherein a laminated material (170) as a raw material is provided in which surface plates (181, 182) are fixed to both surfaces of a core material (183) and the surface plate (181) on the internal side of an arc is not fixed to the core material (183) and, with one end side of the laminated material (170) fixed to frames (30, 40), the other end of the surface plate (181) is moved in the direction apart from the core material (183) so as to bend it in arc-shape, the other end being not fixed to the core material (183).
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: May 31, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Norihisa Okada, Kiyoshi Yoshizaki
  • Patent number: 6196136
    Abstract: In order to provide a car-body structure which has few different kinds of structural members, a small number of structural members, a small occurrence of strain and which is high in dimensional accuracy, and, consequently, in assembling accuracy, each of the car-body blocks is formed of a one-piece structure consisting of an outside plate and a reinforcing plate, each of which is made of a metallic material. The reinforcing plate is composed of panels divided into a plurality of sections; and, each of the panels has a plurality of beads in the form of a long and narrow projection formed by plastic working of a metal plate and extending in the longitudinal direction of the block. A bar-ring in the form of a long hole with a rib extending in the direction of the block is formed between the beads through plastic working. Further, at least one post-shaped protrusion extending in the direction intersecting at a right angle with the bead is provided in each of panels of the reinforcing plate.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: March 6, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kiyoshi Yoshizaki, Yasunari Igawa
  • Patent number: 5437921
    Abstract: A base material for mounting electronic components is provided which has a low density and a coefficient of thermal expansion close to that of aluminum and can be processed with ease. The base material essentially consists of aluminum or an aluminum alloy reinforced with carbon fibers with a volume fraction ranging from 0.15 to 0.55, the carbon fibers in the base material being arranged at random on a surface for mounting an electronic component and being arranged in layer in a direction vertical to the above-described surface.
    Type: Grant
    Filed: October 9, 1991
    Date of Patent: August 1, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasuo Kogo, Takefumi Ito, Mitsuhiro Okumura, Kiyoshi Yoshizaki, Takeji Fujihara, Hirofumi Yamashita
  • Patent number: 5034372
    Abstract: An improved method for producing superconductive oxide substance, wherein a solution containing therein a plurality of elements to constitute the superconductive oxide substance is atomized into mists, then the thus atomized mists are transported on a carrier gas into a chemical reaction device, and, after the chemical reaction in this chemical reaction device, the superconductive oxide substance is deposited on a substrate in a desired shape, with further heat-treatment of the thus deposited superconductive oxide substance in an oxygen-containing atmosphere at a temperature ranging from 200.degree. C. to 1,200.degree. C.
    Type: Grant
    Filed: December 7, 1988
    Date of Patent: July 23, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeru Matsuno, Yoshio Kubo, Kiyoshi Yoshizaki, Mitsunobu Wakata, Syouji Miyashita, Fumio Fujiwara
  • Patent number: 4778539
    Abstract: The present invention is designated to solve such problems whereby a process for producing a PbMo.sub.6 S.sub.8 type compound superconductor excellent in stoichiometric composition and electric characteristics can be provided.In addition to the above, another purpose of the present invention is to provide a process for producing a PbMo.sub.6 S.sub.8 type compound superconductor with stable electrical characteristics.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: October 18, 1988
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshio Kubo, Kiyoshi Yoshizaki
  • Patent number: 4694268
    Abstract: A superconducting solenoid designed to improve working efficiency, heat resistance and electrical insulation of the solenoid to a practical extent. The superconducting solenoid comprises a winding frame, wires formed of filamentary conductors having superconductivity and wound around the winding frame, an insulator formed of alumina fiber material and covering each of the wires for providing electrical insulation, and a resinous material impregnated in between turns of the wires so as to provide a supporting structure. The insulator formed of alumina fiber material is in the form of a sheet, a mat or a yarn.
    Type: Grant
    Filed: May 30, 1986
    Date of Patent: September 15, 1987
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshimi Kawamura, Tadatoshi Yamada, Kiyoshi Hani, Kiyoshi Yoshizaki
  • Patent number: 4629515
    Abstract: A superconductive substance is produced by fabricating any one metal (17) of niobium and vanadium and an easily deformable metal (16) such as Cu into one piece and working it to produce a composite metallic wire, chemically dissolving and removing the easily deformable metal (16) from the composite metallic wire, and then depositing a tin or gallium-base metal (18) and applying heat treatment.Also, a process for producing a superconductive substance comprising fabricating any one metal of niobium and vanadium and an easily deformable metal such as Cu containing at least one metal of tin and gallium into one piece and working it to produce a composite metallic material, heat treating the composite metallic material to form a superconductive substance, and then chemically dissolving and removing the easily deformable metal as a non-conductive substance from the composite metallic material is disclosed.
    Type: Grant
    Filed: December 30, 1982
    Date of Patent: December 16, 1986
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Mitsuyuki Imaizumi, Kiyoshi Yoshizaki
  • Patent number: 4363675
    Abstract: A process for producing a compound-based semiconductor wire having a high mechanical strength and which can be coiled so as to be cooled efficiently. A starting composition is formed by blending at least one metal powder selected from among Nb-based and V-based particles having at least a partial surface coating of an alloy or metal selected from Cu-Sn-based and Ga-based metal layers with at least one of Cu-based, Sn-based, Ga-based, Cu-Sn-based and Cu-Ga-based metal or alloy powder. The cross-sectional area of the composition is reduced followed by a heat treatment. The composition is then drawn into a wire of desired diameter.
    Type: Grant
    Filed: May 18, 1981
    Date of Patent: December 14, 1982
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Kiyoshi Yoshizaki
  • Patent number: RE32178
    Abstract: A process for producing a compound-based semiconductor wire having a high mechanical strength and which can be coiled so as to be cooled efficiently. A starting composition is formed by blending at least one metal powder selected from among Nb-based and V-based particles having at least a partial surface coating of an alloy or metal selected from Cu-Sn-based and Ga-based metal layers with at least one of Cu-based, Sn-based, Ga-based, Cu-Sn-based and Cu-Ga-based metal or alloy powder. The cross-sectional area of the composition is reduced followed by a heat treatment. The composition is then drawn into a wire of desired diameter.
    Type: Grant
    Filed: February 7, 1984
    Date of Patent: June 10, 1986
    Assignee: Mitsubishi Denki K.K.
    Inventor: Kiyoshi Yoshizaki