Publication number: 20110186187
Abstract: A method of producing a copper alloy containing: Ni and/or Si and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, the copper alloy having a precipitate X composed of Ni and Si, and a precipitate Y composed of Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 ?m.
Type:
Application
Filed:
April 11, 2011
Publication date:
August 4, 2011
Applicant:
THE FURUKAWA ELECTRIC CO., LTD.
Inventors:
Kuniteru MIHARA, Nobuyuki TANAKA, Tatsuhiko EGUCHI, Kiyoshige HIROSE
Publication number: 20080047634
Abstract: A copper alloy, containing: Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, with a balance being Cu and inevitable impurities; the copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 ?m.
Type:
Application
Filed:
August 28, 2007
Publication date:
February 28, 2008
Applicant:
THE FURUKAWA ELECTRIC CO., LTD.
Inventors:
Kuniteru MIHARA, Nobuyuki TANAKA, Tatsuhiko EGUCHI, Kiyoshige HIROSE