Patents by Inventor KIYOSHIRO YATAGAWA

KIYOSHIRO YATAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11315731
    Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, external electrodes respectively provided on the first end face and the second end face, and a water repellent agent that is provided on at least one face of four faces of a rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 26, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kiyoshiro Yatagawa, Satoshi Kobayashi
  • Publication number: 20210375550
    Abstract: An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 2, 2021
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kiyoshiro YATAGAWA, Satoshi KOBAYASHI, Ryosuke HOSHINO
  • Publication number: 20210375549
    Abstract: An electronic component includes an element body and at least one external electrode thereon. The element body has a dielectric and inner electrodes. Each external electrode includes a base layer connected to at least one the inner electrode. The base layer is formed on a plurality of surfaces of the element body and contains a metal and a first co-material mixed with the metal. Each external electrode also includes a plating layer formed on at least one face of the base layer. Each external electrode also includes an oxide layer formed on one or more faces of the base layer other than those faces of the base layer on which the plating layer is formed. The oxide layer has a surface layer made from an oxide film of the metal of the base layer and a second co-material.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 2, 2021
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Anju OKADA, Mina AMANO, Kiyoshiro YATAGAWA, Takahisa FUKUDA
  • Publication number: 20210183574
    Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, external electrodes respectively provided on the first end face and the second end face, and a water repellent agent that is provided on at least one face of four faces of a rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kiyoshiro YATAGAWA, Satoshi KOBAYASHI
  • Publication number: 20210175017
    Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 10, 2021
    Inventors: SATOSHI KOBAYASHI, TAKAHISA FUKUDA, TOMOAKI NAKAMURA, MIKIO TAHARA, NAOKI SAITO, KIYOSHIRO YATAGAWA
  • Publication number: 20210151256
    Abstract: A ceramic electronic device includes, a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, external electrodes provided on the first end face and the second end face, and a water repellent agent formed on a surface of the external electrodes. A thickness A (>0) of the water repellent agent on at least one of four faces of the external electrodes that cover an upper face in a stacking direction, a lower face in the stacking direction, and two side faces of the multilayer chip is larger than a thickness B (>0) of the water repellent agent on faces of the external electrodes that cover the first end face and the second end face.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 20, 2021
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kiyoshiro YATAGAWA, Haruna UBUKATA
  • Patent number: 10998135
    Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: May 4, 2021
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Satoshi Kobayashi, Takahisa Fukuda, Tomoaki Nakamura, Mikio Tahara, Naoki Saito, Kiyoshiro Yatagawa
  • Publication number: 20200312571
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.
    Type: Application
    Filed: March 24, 2020
    Publication date: October 1, 2020
    Inventors: Kiyoshiro YATAGAWA, Satoshi KOBAYASHI, Takahisa FUKUDA
  • Publication number: 20200234885
    Abstract: A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 23, 2020
    Inventors: Kiyoshiro YATAGAWA, Satoshi KOBAYASHI, Takahisa FUKUDA
  • Publication number: 20190362895
    Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 28, 2019
    Inventors: SATOSHI KOBAYASHI, TAKAHISA FUKUDA, TOMOAKI NAKAMURA, MIKIO TAHARA, NAOKI SAITO, KIYOSHIRO YATAGAWA