Abstract: A resonator includes a resonator element including a substrate gradually increasing in thickness from an outer edge toward a center, excitation electrodes respectively disposed on both principal surfaces of the substrate, and a pair of electrode pads electrically connected to the excitation electrodes, disposed on at least one of the both principal surfaces, and disposed on one end side of the substrate, and a second substrate as a base, the pair of electrode pads are bonded to the second substrate via respective first bonding members, two places of the other end of the substrate on the opposite side to the one end are bonded to the second substrate via respective second bonding members, and a distance S1 between the two first bonding members, and a distance S2 between the two second bonding members fulfill S1<S2.

Abstract: A resonator includes a resonator element including a substrate gradually increasing in thickness from an outer edge toward a center, excitation electrodes respectively disposed on both principal surfaces of the substrate, and a pair of electrode pads electrically connected to the excitation electrodes, disposed on at least one of the both principal surfaces, and disposed on one end side of the substrate, and a second substrate as a base, the pair of electrode pads are bonded to the second substrate via respective first bonding members, two places of the other end of the substrate on the opposite side to the one end are bonded to the second substrate via respective second bonding members, and a distance S1 between the two first bonding members, and a distance S2 between the two second bonding members fulfill S1<S2.

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.