Patents by Inventor Kiyotaka Nakamura
Kiyotaka Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190202746Abstract: A ceramic bonded body may include a first member, a second member, a joining layer between the first member and the second member, and a covering layer which covers the joining layer and is located over the first member and the second member. The first member and the second member may include aluminum nitride-based ceramic. The joining layer and the covering layer may include at least aluminum, calcium, yttrium, and oxygen where, in 100 mass % of all of the constituents configuring the joining layer and the covering layer, the aluminum is 21 mass % or more converted to oxides, the calcium is 21 mass % or more converted to oxides, and the sum of the aluminum and the calcium converted to oxides is 86 mass % or more. The covering layer has a content of yttrium converted to oxides greater than that of the joining layer.Type: ApplicationFiled: February 24, 2017Publication date: July 4, 2019Inventors: Kiyotaka NAKAMURA, Masayuki MORIYAMA
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Publication number: 20190168984Abstract: A medium discharge device includes a discharge roller pair that is provided with a discharge driving roller and a discharge driven roller which drivably rotates in contact with the discharge driving roller, and a medium receiving tray which receives the medium that is fed and discharged by the discharge roller pair, in which the medium receiving tray includes a guide member which guides such that a tip end of the medium which is discharged from the discharge roller pair enters the medium mounting surface at a predetermined angle, and the guide member is provided to be elastically displaceable in an advancing and retreating direction with respect to the medium mounting surface of the medium receiving tray and is displaced in a direction coming close to the medium mounting surface according to raising of a pressing load due to the medium that is discharged to the medium receiving tray.Type: ApplicationFiled: February 5, 2019Publication date: June 6, 2019Inventor: Kiyotaka NAKAMURA
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Publication number: 20190100396Abstract: A medium feeding device includes a medium placing portion, a feeding roller that feeds paper, a medium movement detecting portion that is positioned on a placing region of the paper of the medium placing portion in a medium feeding direction and is capable of detecting movement of the paper being fed in a width direction intersecting the medium feeding direction, and a controller that stops feeding of the paper in a case in which a physical quantity relating to movement of paper in the width direction exceeds a predetermined threshold based on a detected result by the medium movement detecting portion.Type: ApplicationFiled: September 28, 2018Publication date: April 4, 2019Inventors: Takayuki SHIOTA, Kazutoshi NISHIDA, Kiyotaka NAKAMURA
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Patent number: 10227200Abstract: A medium discharge device includes a discharge roller pair that is provided with a discharge driving roller and a discharge driven roller which drivably rotates in contact with the discharge driving roller, and a medium receiving tray which receives the medium that is fed and discharged by the discharge roller pair, in which the medium receiving tray includes a guide member which guides such that a tip end of the medium which is discharged from the discharge roller pair enters the medium mounting surface at a predetermined angle, and the guide member is provided to be elastically displaceable in an advancing and retreating direction with respect to the medium mounting surface of the medium receiving tray and is displaced in a direction coming close to the medium mounting surface according to raising of a pressing load due to the medium that is discharged to the medium receiving tray.Type: GrantFiled: February 12, 2018Date of Patent: March 12, 2019Assignee: Seiko Epson CorporationInventor: Kiyotaka Nakamura
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Patent number: 10207882Abstract: A pair of edge guides provided on a medium mounting section of a medium feeding apparatus each include a volume limiter spaced from the mounting surface of the medium mounting section and extending from the guide surface of at least one of the pair of edge guides in a direction intersecting the guide surface, the volume limiter including a limiting surface that limits a number of sheets mounted on the medium mounting section. The limiting surface includes a groove extending in the feed direction, at a position between a corner portion formed at an intersection of an end portion of the limiting surface in the width direction and the guide surface, and the other end portion of the limiting surface, and configured to insert at least a part of a side edge of the medium, to thereby restrict the side edge from moving in the width direction.Type: GrantFiled: December 13, 2017Date of Patent: February 19, 2019Assignee: Seiko Epson CorporationInventors: Hiromichi Kitsuki, Kiyotaka Nakamura
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Publication number: 20190024991Abstract: In the present disclosure, a flow path member includes a substrate, a flow path and a first oxide layer. The substrate contains non-oxide ceramics, and includes an outer surface. The flow path is in the substrate, and includes an inlet and an outlet. The first oxide layer is disposed on the outer surface.Type: ApplicationFiled: August 26, 2016Publication date: January 24, 2019Inventors: Kiyotaka Nakamura, Masayuki Moriyama, Yuusaku Ishimine
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Publication number: 20180237348Abstract: A ceramic bonded body of the disclosure includes a first silicon carbide ceramics, a second silicon carbide ceramics, and a bonding layer positioned between the first silicon carbide ceramics and the second silicon carbide ceramics. The bonding layer contains 25 mass % or more metallic silicon, and 25 mass % or more silicon carbide assuming all components constituting the bonding layer as 100 mass %, and a total of the metallic silicon and the silicon carbide is 75 mass % or more, and the bonding layer further contains at least one of nickel silicide and chromium silicide.Type: ApplicationFiled: September 28, 2016Publication date: August 23, 2018Inventors: Kiyotaka NAKAMURA, Masayuki MORIYAMA
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Publication number: 20180170695Abstract: A pair of edge guides provided on a medium mounting section of a medium feeding apparatus each include a volume limiter spaced from the mounting surface of the medium mounting section and extending from the guide surface of at least one of the pair of edge guides in a direction intersecting the guide surface, the volume limiter including a limiting surface that limits a number of sheets mounted on the medium mounting section. The limiting surface includes a groove extending in the feed direction, at a position between a corner portion formed at an intersection of an end portion of the limiting surface in the width direction and the guide surface, and the other end portion of the limiting surface, and configured to insert at least a part of a side edge of the medium, to thereby restrict the side edge from moving in the width direction.Type: ApplicationFiled: December 13, 2017Publication date: June 21, 2018Inventors: Hiromichi KITSUKI, Kiyotaka NAKAMURA
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Publication number: 20180162676Abstract: A medium discharge device includes a discharge roller pair that is provided with a discharge driving roller and a discharge driven roller which drivably rotates in contact with the discharge driving roller, and a medium receiving tray which receives the medium that is fed and discharged by the discharge roller pair, in which the medium receiving tray includes a guide member which guides such that a tip end of the medium which is discharged from the discharge roller pair enters the medium mounting surface at a predetermined angle, and the guide member is provided to be elastically displaceable in an advancing and retreating direction with respect to the medium mounting surface of the medium receiving tray and is displaced in a direction coming close to the medium mounting surface according to raising of a pressing load due to the medium that is discharged to the medium receiving tray.Type: ApplicationFiled: February 12, 2018Publication date: June 14, 2018Inventor: Kiyotaka NAKAMURA
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Patent number: 9938107Abstract: A medium discharge device includes a discharge roller pair that is provided with a discharge driving roller and a discharge driven roller which drivably rotates in contact with the discharge driving roller, and a medium receiving tray which receives the medium that is fed and discharged by the discharge roller pair, in which the medium receiving tray includes a guide member which guides such that a tip end of the medium which is discharged from the discharge roller pair enters the medium mounting surface at a predetermined angle, and the guide member is provided to be elastically displaceable in an advancing and retreating direction with respect to the medium mounting surface of the medium receiving tray and is displaced in a direction coming close to the medium mounting surface according to raising of a pressing load due to the medium that is discharged to the medium receiving tray.Type: GrantFiled: October 14, 2016Date of Patent: April 10, 2018Assignee: Seiko Epson CorporationInventor: Kiyotaka Nakamura
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Publication number: 20180041651Abstract: A lower read sensor is configured such that a lower read surface of the lower read sensor can be switched between a forward position in which the lower read surface is moved toward an upper read surface of an upper read sensor and a rearward position in which the lower read surface is moved away from the upper read surface farther than the forward position, and a controller switches the lower read sensor to the rearward position to transport a first medium having a predetermined stiffness and switches the lower read sensor to the forward position to transport a second medium having a stiffness lower than that of the first medium.Type: ApplicationFiled: August 2, 2017Publication date: February 8, 2018Inventor: Kiyotaka NAKAMURA
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Patent number: 9820379Abstract: A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.Type: GrantFiled: May 30, 2012Date of Patent: November 14, 2017Assignee: Kyocera CorporationInventors: Kiyotaka Nakamura, Yoshio Ohashi, Yuuichi Abe, Eisuke Hirano, Kunihide Shikata, Keiichi Sekiguchi
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Publication number: 20170107072Abstract: A medium discharge device includes a discharge roller pair that is provided with a discharge driving roller and a discharge driven roller which drivably rotates in contact with the discharge driving roller, and a medium receiving tray which receives the medium that is fed and discharged by the discharge roller pair, in which the medium receiving tray includes a guide member which guides such that a tip end of the medium which is discharged from the discharge roller pair enters the medium mounting surface at a predetermined angle, and the guide member is provided to be elastically displaceable in an advancing and retreating direction with respect to the medium mounting surface of the medium receiving tray and is displaced in a direction coming close to the medium mounting surface according to raising of a pressing load due to the medium that is discharged to the medium receiving tray.Type: ApplicationFiled: October 14, 2016Publication date: April 20, 2017Inventor: Kiyotaka NAKAMURA
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Publication number: 20160001526Abstract: A ceramic joined body includes a first silicon-carbide based sintered body; and a second silicon-carbide based sintered body, the first silicon-carbide based sintered body and the second silicon-carbide based sintered body being joined together by a joining layer, the joining layer being coated by a first coating layer containing metallic silicon as a main component, the first coating layer being disposed over the first silicon-carbide based sintered body and the second silicon-carbide based sintered body. Further, a flow passage body includes the ceramic joined body provided with a passage.Type: ApplicationFiled: February 27, 2014Publication date: January 7, 2016Inventors: Naoyuki SHINO, Kiyotaka NAKAMURA, Yoshinori HIRANO
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Patent number: 9161444Abstract: A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.Type: GrantFiled: September 28, 2012Date of Patent: October 13, 2015Assignee: KYOCERA CORPORATIONInventors: Kiyotaka Nakamura, Yoshio Ohashi, Kunihide Shikata
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Patent number: 9012783Abstract: A brazing material includes silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten. The content of copper is not less than 35% by mass and not more than 50% by mass, based on the total amount of silver, copper, and the elements A, B and C. A heat dissipation base includes a supporting substrate, circuit members on a first main surface of the substrate, and a heat dissipation member on a second main surface opposite to the first main surface. The circuit members are joined to the supporting substrate by a joining layer composed of the brazing material.Type: GrantFiled: May 27, 2010Date of Patent: April 21, 2015Assignee: Kyocera CorporationInventors: Yuuichi Abe, Kiyotaka Nakamura, Kiyoshi Yakubo
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Publication number: 20140284088Abstract: A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.Type: ApplicationFiled: September 28, 2012Publication date: September 25, 2014Inventors: Kiyotaka Nakamura, Yoshio Ohashi, Kunihide Shikata
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Publication number: 20140268589Abstract: A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.Type: ApplicationFiled: May 30, 2012Publication date: September 18, 2014Applicant: Kyocera CorporationInventors: Kiyotaka Nakamura, Yshio Ohashi, Yuuichi Abe, Eisuke Hirano, Kunihide Shikata, Kiichi Sekiguchi
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Patent number: 8206035Abstract: The invention provides a low-friction sliding mechanism, a low-friction agent composition, a friction reduction method, a manual transmission and a final reduction gear unit that can exert very excellent low friction characteristics to sliding surfaces present under various applications, and, in particular, that have more excellent low friction characteristics than that of a combination of an existing steel material and an organic Mo compound. The low-friction sliding mechanism has an oxygen-containing organic compound or an aliphatic amine compound interposed between sliding surfaces that a DLC coated sliding member and a sliding member form. The low-friction agent composition contains an oxygen-containing organic compound or an aliphatic amine compound. The friction reduction method includes supplying the low-friction agent composition between sliding surfaces that a DLC coated sliding member and a sliding member form.Type: GrantFiled: August 6, 2004Date of Patent: June 26, 2012Assignees: Nissan Motor Co., Ltd., Nippon Oil CorporationInventors: Jean Michel Martin, Shigeki Takeshima, Shozaburo Konishi, Makoto Kano, Yutaka Mabuchi, Takao Ishikawa, Takafumi Ueno, Kiyotaka Nakamura, Takahiro Hamada
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Publication number: 20120080216Abstract: Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly; and an electronic device wherein an electronic component is mounted on circuit members of this heat dissipation base. The brazing material comprises silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten.Type: ApplicationFiled: May 27, 2010Publication date: April 5, 2012Applicant: KYOCERA CORPORATIONInventors: Yuuichi Abe, Kiyotaka Nakamura, Kiyoshi Yakubo