Abstract: The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, in which a dispersion term dD of the Hansen solubility parameters satisfies 10?dD?20, a polarity term dP of the Hansen solubility parameters satisfies 6?dP?9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9?dH?11.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.

Abstract: A terminal material in which galvanic corrosion is not occurred using a copper or copper alloy base material as a terminal crimped to an end part of an electrical wire formed from an aluminum wire material: an intermediate zinc layer 4 formed from zinc or zinc alloy and a tin layer 5 formed from tin or tin alloy are layered in this order on a base material 2 formed from copper or copper alloy; the intermediate zinc layer 4 has a thickness of 0.1 ?m to 5.0 ?m inclusive and a zinc concentration equal to or more than 5 mass %; and the tin layer 5 has a zinc concentration of 0.4 mass % to 15 mass % inclusive and a grain size of the tin layer 5 is 0.1 ?m to 3.0 ?m inclusive preferably.

Abstract: A method of manufacturing tin-plated copper terminal material as a terminal crimped to a terminal end of an electric wire made of an aluminum wire material, using a base member of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer having a nickel content of 5 mass % to 50 mass % inclusive and a thickness of 0.1 ?m to 5.0 ?m inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40° C. to 160° C. inclusive for 30 minutes or longer.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing phosphonium salt with two or more of aromatic rings is provided.

Abstract: A method of manufacturing tin-plated copper terminal material as a terminal crimped to a terminal end of an electric wire made of an aluminum wire material, using a base member of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer having a nickel content of 5 mass % to 50 mass % inclusive and a thickness of 0.1 ?m to 5.0 ?m inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40° C. to 160° C. inclusive for 30 minutes or longer.

Abstract: A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu6Sn5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 ?m to 0.6 ?m (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing phosphonium salt with two or more of aromatic rings is provided.

Abstract: A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu6Sn5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 ?m to 0.6 ?m (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).

Abstract: This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. (a) The electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive. (b) When a molecular weight of the polyethylene glycol is given as Z and a current density during the electrolysis is given as X (A/dm2), the electrolysis is performed under conditions that fulfill the following relational expressions, 1000?Z?2000 1.2?(Z?1000)×0.0008?X?2.2?(Z?1000)×0.001.

Abstract: The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

Abstract: The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, in which a dispersion term dD of the Hansen solubility parameters satisfies 10?dD?20, a polarity term dP of the Hansen solubility parameters satisfies 6?dP?9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9?dH?11.

Abstract: The present invention provides an additive for high-purity copper electrolytic refining, a method of producing high-purity copper, and a high-purity electrolytic copper. This additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in copper electrolytic refining. The additive includes a silver and chlorine reducing agent of electrolytic copper which is formed of tetrazoles which is one of a tetrazole and a tetrazole derivative.

Abstract: The present invention provides an additive for high-purity copper electrolytic refining and a method of producing high-purity copper using the additive. The additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in electrolytic refining for producing high-purity copper. The additive includes a main agent formed of a non-ionic surfactant which has a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, and a stress relaxation agent formed of a polyvinyl alcohol or a derivative thereof.

Abstract: Provided are a phosphorous-containing copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the phosphorous-containing copper anode. The phosphorous-containing copper anode obtains a crystal grain boundary structure having a special grain boundary ratio L?N/LN of 0.4 or more. LN is a unit total special grain boundary length corresponding to a unit area of 1 mm2 obtained by converting a total grain boundary length L. L?N is a unit total special boundary length corresponding to a unit area of 1 mm2 obtained by converting a total special grain boundary length L?. By having the configuration described above, a black film is formed evenly on the copper anode at the early stage of the electrolytic copper plating. Plating defect can be reduced by preventing the black film being fallen.

Abstract: By forming a nickel-based coating layer or a cobalt-based coating layer having a coating thickness of 0.005 ?m or larger and 0.05 ?m or smaller on an outermost surface of a tin-based surface layer of a terminal material of low-insertion force in which an asperity shape of an interface between a copper-tin alloy layer and a tin-based surface layer is controlled, it is possible to reduce insertion force of fitting even though all-purpose tin-plated terminal material is used by combination.

Abstract: This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. (a) The electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive. (b) When a molecular weight of the polyethylene glycol is given as Z and a, current density during the electrolysis is given as X (A/dm2), the electrolysis is performed under conditions that fulfill the following relational expressions, 1000?Z?2000 1.2?(Z?1000)×0.0008?X?2.2?(Z?1000)×0.001.

Abstract: Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The highly pure copper anode obtains a crystal grain boundary structure having a special grain boundary ratio L?N/LN of 0.35 or more. LN is a unit total special grain boundary length. L?N is a unit total special boundary length. By having the configuration described above, plating defect can be reduced by suppressing the occurrence of the particles, such as the slime or the like, which are generated on the anode side in the plating bath.