Patents by Inventor Kiyotaka Okazaki

Kiyotaka Okazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5677066
    Abstract: A sealing part for connector waterproofing is disclosed, which comprises a vulcanized molding obtained from a composition comprising 100 parts by weight of a polyorganosiloxane (1), from 5 to 100 parts by weight of a reinforcing silica powder filler (2), from 0.01 to 10 parts by weight of a hydrogensiloxane polymer (3) having two or more Si-H bonds per molecule, and from 0.01 to 5 parts by weight of t-butyl peroxy-3,5,5-trimethylhexanoate (4). The sealing part for connector waterproofing of the present invention is satisfactory in heat resistance, low-temperature resistance, and oil resistance and can be produced at low cost in a reduced molding time.
    Type: Grant
    Filed: July 20, 1995
    Date of Patent: October 14, 1997
    Assignee: Yazaki Corporation
    Inventors: Kiyotaka Okazaki, Masahiro Kanda
  • Patent number: 5668225
    Abstract: An oil-bleeding waterproof sealer for a connector comprising a vulcanized and molded article of a composition comprising: (A) 100 parts by weight of a diorganopolysiloxane green rubber containing at least two alkenyl groups bonded to silicon atoms per molecule thereof, (B) from 10 to 100 parts by weight of a reinforcing filler, (C) from 0.1 to 10 parts by weight of an organohydrogenopolysiloxane having at least two hydrogen atoms bonded to silicon atoms per molecule thereof, (D) from 1 to 30 parts by weight of a phenyl-containing diorganopolysiloxane having a viscosity of 1 to 3,000 cSt at 25.degree. C., and (E) a catalytic amount of a catalyst for hydrosilylation having a particle size of 0.01 to 20 .mu.m, which comprises a platinum catalyst and a non-silicone series thermoplastic resin having a glass transition point of 50.degree. to 200.degree. C., with the proportion of metallic platinum in the catalyst for hydrosilylation being 0.01 to 5% by weight.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: September 16, 1997
    Assignee: Yazaki Corporation
    Inventors: Kiyotaka Okazaki, Sinichi Kogure, Masahiro Kanda, Shiroh Kobayashi
  • Patent number: 5631321
    Abstract: The present invention provides a sealing component for connector waterproofing having an excellent heat resistance, low-temperature resistance and oil resistance which can be economically produced in a reduced molding time. A novel sealing component for connector waterproofing is provided, which comprises a vulcanized composition comprising at least (a) 100 parts by weight of an organopolysiloxane represented by the following average composition formula (I), (b) from 5 to 500 parts by weight of a finely divided silica filler, (c) from 0.01 to 5 parts by weight of a dialkyl peroxide or peroxy ketal which has a half-life of 1 hour at a temperature of from 130.degree. C. to 150.degree. C., (d) from 0.1 to 5 parts by weight of a silicon compound having two or more Si--H bonds per molecule, and (e) from 0.01 to 2 parts by weight of an organic peroxide represented by the following general formula (II):R.sup.1.sub.m SiO.sub.(4-m)/2 (I)wherein R.sup.
    Type: Grant
    Filed: August 1, 1995
    Date of Patent: May 20, 1997
    Assignees: Yazaki Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Kiyotaka Okazaki, Masahiro Kanda
  • Patent number: 5618880
    Abstract: The present invention provides a sealing component for connector waterproofing having an excellent heat resistance, low-temperature resistance and oil resistance which can be economically produced in a reduced molding time. A novel sealing component for connector waterproofing is provided, which comprises a vulcanized composition comprising at least (a) 100 parts by weight of an organopolysiloxane represented by the following average composition formula (I) containing at least two alkenyl groups per molecule and having a viscosity of at least 100,000 cs, (b) from 0.1 to 20 parts by weight of an organohydrogenpolysiloxane represented by the following average composition formula (II) containing at least two hydrogen atoms directly bonded to silicon atom per molecule, (c) from 5 to 500 parts by weight of a finely divided silica filler, (d) the catalytic amount of a platinum catalyst, (e) from 0.005 to 5 parts by weight of a sulfide compound represented by the following general formula (III), and (f) from 0.
    Type: Grant
    Filed: August 1, 1995
    Date of Patent: April 8, 1997
    Assignees: Yazaki Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Kiyotaka Okazaki, Masahiro Kanda