Abstract: The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes.

Abstract: The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes.

Abstract: There is provided a piezoelectric vibrator that can hold the crystal plate parallel to the base substrate regardless of the shape of the crystal plate. A method for manufacturing the piezoelectric vibrator, and an oscillator are also provided. The piezoelectric vibrator includes a base substrate; a lid substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes and mount electrodes; through electrodes provided in through holes formed through the base substrate; inner electrodes formed on the upper surface of the base substrate; and metal bumps formed at predetermined positions of the inner electrodes. The piezoelectric vibrating piece is tapered towards the ends along the longitudinal direction, and mounted on the metal bumps in a cantilever fashion.