Patents by Inventor Kiyotaka Teshima
Kiyotaka Teshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420433Abstract: An element placement unit for placing a light emitting unit and a light receiving unit of a smoke detector that detects smoke by receiving scattered light caused by a scattering of light from the light emitting unit by the smoke, using the light receiving unit, includes: a light emission-side electrode portion having conductivity for placing the light emitting unit while electrically connecting the light emitting unit; and a light reception-side electrode portion having conductivity for placing the light receiving unit while electrically connecting the light receiving unit.Type: ApplicationFiled: September 1, 2023Publication date: December 28, 2023Inventor: Kiyotaka Teshima
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Patent number: 7768029Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.Type: GrantFiled: August 20, 2007Date of Patent: August 3, 2010Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
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Publication number: 20080001163Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.Type: ApplicationFiled: August 20, 2007Publication date: January 3, 2008Applicants: TOYODA GOSEI CO., LTD., KOHA CO., LTD.Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
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Patent number: 7279723Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.Type: GrantFiled: March 19, 2004Date of Patent: October 9, 2007Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
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Patent number: 6834977Abstract: Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.Type: GrantFiled: June 4, 2001Date of Patent: December 28, 2004Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Yoshinobu Suehiro, Yuji Takahashi, Hideaki Kato, Koichi Kaga, Kiyotaka Teshima, Shunsuke Ohtsuka
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Publication number: 20040240203Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.Type: ApplicationFiled: March 19, 2004Publication date: December 2, 2004Applicants: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
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Patent number: 6713877Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.Type: GrantFiled: May 3, 2002Date of Patent: March 30, 2004Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Atsuo Hirano, Yukio Yoshikawa, Kiyotaka Teshima, Takemasa Yasukawa
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Publication number: 20020145205Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.Type: ApplicationFiled: May 3, 2002Publication date: October 10, 2002Inventors: Atsuo Hirano, Yukio Yoshikawa, Kiyotaka Teshima, Takemasa Yasukawa
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Patent number: 6445011Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.Type: GrantFiled: January 28, 2000Date of Patent: September 3, 2002Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Atsuo Hirano, Yukio Yoshikawa, Kiyotaka Teshima, Takemasa Yasukawa
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Publication number: 20020001192Abstract: Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is released therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.Type: ApplicationFiled: June 4, 2001Publication date: January 3, 2002Inventors: Yoshinobu Suehiro, Yuji Takahashi, Hideaki Kato, Koichi Kaga, Kiyotaka Teshima, Shunsuke Ohtsuka
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Patent number: D570306Type: GrantFiled: May 12, 2005Date of Patent: June 3, 2008Assignee: Koha Co., Ltd.Inventor: Kiyotaka Teshima