Patents by Inventor Kiyotaka Teshima

Kiyotaka Teshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7768029
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: August 3, 2010
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Publication number: 20080001163
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Application
    Filed: August 20, 2007
    Publication date: January 3, 2008
    Applicants: TOYODA GOSEI CO., LTD., KOHA CO., LTD.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: 7279723
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: October 9, 2007
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: 6834977
    Abstract: Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: December 28, 2004
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Yoshinobu Suehiro, Yuji Takahashi, Hideaki Kato, Koichi Kaga, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Publication number: 20040240203
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Application
    Filed: March 19, 2004
    Publication date: December 2, 2004
    Applicants: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: 6713877
    Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: March 30, 2004
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Atsuo Hirano, Yukio Yoshikawa, Kiyotaka Teshima, Takemasa Yasukawa
  • Publication number: 20020145205
    Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.
    Type: Application
    Filed: May 3, 2002
    Publication date: October 10, 2002
    Inventors: Atsuo Hirano, Yukio Yoshikawa, Kiyotaka Teshima, Takemasa Yasukawa
  • Patent number: 6445011
    Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: September 3, 2002
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Atsuo Hirano, Yukio Yoshikawa, Kiyotaka Teshima, Takemasa Yasukawa
  • Publication number: 20020001192
    Abstract: Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is released therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.
    Type: Application
    Filed: June 4, 2001
    Publication date: January 3, 2002
    Inventors: Yoshinobu Suehiro, Yuji Takahashi, Hideaki Kato, Koichi Kaga, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: D570306
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: June 3, 2008
    Assignee: Koha Co., Ltd.
    Inventor: Kiyotaka Teshima