Patents by Inventor Kiyotaka YOKOYAMA

Kiyotaka YOKOYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11425843
    Abstract: A heat radiation structure (10) includes a casing (4) configured to accommodate a heating element (1), and a heat-sink type component (2) configured to directly or indirectly absorb heat from the heating element (1), contactlessly face the casing (4), and conduct the heat to the casing (4) via air existing in an internal space of the casing (4), wherein at least either the heat-sink type component (2) or the casing (4) is configured in such a way that, when heat is generated from the heating element (1), a distance between the heat-sink type component (2) and the casing (4) becomes nearer in a region of the internal space (3) in which temperature does not rise relatively easily than in a region of the internal space (3) in which temperature rises relatively easily.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: August 23, 2022
    Assignee: NEC Platforms, Ltd.
    Inventors: Takahiro Yagi, Kiyotaka Yokoyama, Akira Katsumata, Wataru Imura
  • Patent number: 11224148
    Abstract: A case (2) includes a tubular body (6) extending vertically and a top plate (8) disposed at a top edge of the tubular body (6), the case being capable of accommodating a heat-generating element (5). Upward ventholes (16) for discharging the heated air (P), which is heated by the heat-generating element (5), to the outside are formed in the top plate 8. A partition wall (17) that protrudes downwardly from the top plate (8) is disposed between the upward ventholes (16) and the tubular body (6). An air accumulating part (20) surrounded by the tubular body (6), the top plate (8), and the partition wall (17) is formed.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: January 11, 2022
    Assignee: NEC Platforms, Ltd.
    Inventors: Wataru Imura, Kiyotaka Yokoyama, Akira Katsumata, Takahiro Yagi
  • Publication number: 20210153393
    Abstract: A case (2) includes a tubular body (6) extending vertically and a top plate (8) disposed at a top edge of the tubular body (6), the case being capable of accommodating a heat-generating element (5). Upward ventholes (16) for discharging the heated air (P), which is heated by the heat-generating element (5), to the outside are formed in the top plate 8. A partition wall (17) that protrudes downwardly from the top plate (8) is disposed between the upward ventholes (16) and the tubular body (6). An air accumulating part (20) surrounded by the tubular body (6), the top plate (8), and the partition wall (17) is formed.
    Type: Application
    Filed: June 14, 2017
    Publication date: May 20, 2021
    Applicant: NEC Platforms, Ltd.
    Inventors: Wataru IMURA, Kiyotaka YOKOYAMA, Akira KATSUMATA, Takahiro YAGI
  • Publication number: 20210068286
    Abstract: Provided is a heat-dissipating waterproof structure having both excellent heat dissipation ability and high waterproofness. A heat-dissipating waterproof structure (300) provided between a top part (203) of a casing (200) to accommodate a heat source (102) and the heat source(102) includes a water receiving part (301) that guides a liquid having entered into the casing (200) through an outlet (203A) provided in the top part (203) of the casing (200), and a water guide channel (302) that guides the liquid having been guided by the water receiving part (301) to be discharged to outside of a space where the heat source (102) is accommodated, and the water receiving part (301) has at least a sloping surface which gradually becomes higher the further it is from being immediately above the heat source (102).
    Type: Application
    Filed: November 30, 2018
    Publication date: March 4, 2021
    Applicant: NEC Platforms, Ltd.
    Inventors: Takahiro YAGI, Kiyotaka YOKOYAMA, Akira KATSUMATA, Wataru IMURA
  • Publication number: 20200375065
    Abstract: A heat radiation structure (10) includes a casing (4) configured to accommodate a heating element (1), and a heat-sink type component (2) configured to directly or indirectly absorb heat from the heating element (1), contactlessly face the casing (4), and conduct the heat to the casing (4) via air existing in an internal space of the casing (4), wherein at least either the heat-sink type component (2) or the casing (4) is configured in such a way that, when heat is generated from the heating element (1), a distance between the heat-sink type component (2) and the casing (4) becomes nearer in a region of the internal space (3) in which temperature does not rise relatively easily than in a region of the internal space (3) in which temperature rises relatively easily.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 26, 2020
    Applicant: NEC Platforms, Ltd.
    Inventors: Takahiro YAGI, Kiyotaka YOKOYAMA, Akira KATSUMATA, Wataru IMURA