Abstract: In an electrical connecting apparatus, a thermal deformation restriction member, a reinforcing plate, and an auxiliary member are made of materials having smaller thermal expansion coefficients in this order, and a wiring board supporting a probe assembly is coupled with the reinforcing plate. The auxiliary member has a void inside the coupling region with the reinforcing plate. The void receives the deformed part when the center portion of the wiring board is deformed toward the reinforcing plate. Thus, the thermal deformation restriction member, the reinforcing plate, and the auxiliary member function as a three-layer bimetal having a sandwich structure, and the thermal deformation of the wiring board is restricted effectively.

Abstract: An electrical connecting apparatus for use in electrical measurement of a device under test comprises a supporting member and a flat plate-like probe base plate. On one surface of the probe base plate are provided multiple probes abutting on electrical connecting terminals of the device under test undergoing an electrical test. Also, on the other surface of the probe base plate is formed a securing portion provided with a screw hole opened at the top portion. It further has a generally cylindrical spacer and a screw member passing through the spacer and whose tip end is screwed in the screw hole of the securing portion. As for the spacer, movement in the axial direction is restricted in relation to the supporting member by a restricting means.

Abstract: An electrical connecting apparatus for use in an electrical inspection of a tester and a device under test. The electrical connecting apparatus is provided with a probe assembly to be tightened by tightening screw members toward the support member and having a wiring board interposed between itself and a support member. In order to prevent deformation of the probe board of the probe assembly due to tightening of the screw members, a spacer disposed to penetrate the wiring board is between the support member and probe board and penetrated by the screw members. Both end faces of the spacer are convex spherical surface.

Abstract: The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing of the probe assembly caused by the temperature difference between the upper surface and the lower surface of the probe assembly. An electrical connecting apparatus 10 comprises a probe assembly having a plurality of contactors 14 on a lower surface and a plurality of electronic elements 18 arranged on an upper surface, a cover 32 arranged on the upper surface of the probe assembly so as to close a space 30 in which the electronic elements are arranged, and two grippers 42 attached to the cover. Each gripper 42 has one end 42a and the other end 42a, has a region ranging from one end to the other end formed approximately in a U-shape, and is attached to a main body portion 33 of the cover at both the ends.

Abstract: An electrical connecting apparatus for use in an electrical inspection of a tester and a device under test. The electrical connecting apparatus is provided with a probe assembly to be tightened by tightening screw members toward the support member and having a wiring board interposed between itself and a support member. In order to prevent deformation of the probe board of the probe assembly due to tightening of the screw members, a spacer disposed to penetrate the wiring board is between the support member and probe board and penetrated by the screw members. Both end faces of the spacer are convex spherical surface.

Abstract: An electrical connecting apparatus for use in electrical measurement of a device under test comprises a supporting member and a flat plate-like probe base plate. On one surface of the probe base plate are provided multiple probes abutting on electrical connecting terminals of the device under test undergoing an electrical test. Also, on the other surface of the probe base plate is formed a securing portion provided with a screw hole opened at the top portion. It further has a generally cylindrical spacer and a screw member passing through the spacer and whose tip end is screwed in the screw hole of the securing portion. As for the spacer, movement in the axial direction is restricted in relation to the supporting member by a restricting means.

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: A mounting apparatus that does not compromise the strength of a probe board. The apparatus comprises a probe board spaced from a support member by a spacer. A fixed portion with a female screw hole is mounted on one surface of the probe board. A male screw member is threaded into the screw hole for the purpose of tightening the support member to the probe board at a fixed distance defined by the length of the spacer. The probe board has a support plate. Pluralities of conductive paths penetrate the support plate. A wiring plate wherein wiring paths are connected to corresponding conductive paths, and whose one surface is fixed to the support plate. The other surface is provided with probes corresponding to the wiring paths. The fixed portion includes a female screw member at an area where no conductive paths are formed.

Abstract: The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing of the probe assembly caused by the temperature difference between the upper surface and the lower surface of the probe assembly. An electrical connecting apparatus 10 comprises a probe assembly having a plurality of contactors 14 on a lower surface and a plurality of electronic elements 18 arranged on an upper surface, a cover 32 arranged on the upper surface of the probe assembly so as to close a space 30 in which the electronic elements are arranged, and two grippers 42 attached to the cover. Each gripper 42 has one end 42a and the other end 42a, has a region ranging from one end to the other end formed approximately in a U-shape, and is attached to a main body portion 33 of the cover at both the ends.

Abstract: In an electrical connecting apparatus, a thermal deformation restriction member, a reinforcing plate, and an auxiliary member are made of materials having smaller thermal expansion coefficients in this order, and a wiring board supporting a probe assembly is coupled with the reinforcing plate. The auxiliary member has a void inside the coupling region with the reinforcing plate. The void receives the deformed part when the center portion of the wiring board is deformed toward the reinforcing plate. Thus, the thermal deformation restriction member, the reinforcing plate, and the auxiliary member function as a three-layer bimetal having a sandwich structure, and the thermal deformation of the wiring board is restricted effectively.

Abstract: A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: The present invention provides an electrical connecting apparatus that does not cause lack of mechanical strength in a probe board. The electrical connecting apparatus comprises a probe board spaced from a support member and arranged with its one surface opposed to the support member. On one surface of the probe board is provided a fixed portion having an opened screw hole at its top portion, and on the other surface are provided probes that are connected to a tester. The electrical connecting apparatus comprises a cylindrical spacer keeping a distance from the support member to a top surface of the fixed portion and a male screw member screwed in the screw hole for the purpose of tightening the support member and the probe board at a distance in accordance with the length of the spacer.

Abstract: The present invention provides a semiconductor test apparatus that can reduce influence of noise in high-frequency measurement and that can be manufactured inexpensively by simplification of the constitution. A semiconductor test apparatus according to the present invention is one for use in an electrical test of a semiconductor wafer in which numerous integrated circuits each having electrode pads are incorporated. It comprises a probe card and a tester having a connection portion to the probe card. The probe card has numerous probes that can be connected to the electrode pads of the semiconductor wafer and a probe board having on one surface probe lands to which the probes are attached, having on the other surface tester lands corresponding to the probes, and having wiring paths each connecting the probe land and the tester land corresponding to each other. The tester is directly connected to the probe card as the connection portion contacts the tester lands.

Abstract: A probe having a first and a second arm portion extending between first and second connecting portions connecting the first and second arm portions respectively at their front end portion and base end portion, and a needle point portion below the first connecting portion. At least one of the entire first and second arm portions or the upper or lower edge portions of the first and second arm portions are arcuate.

Abstract: To restrain misregistration of tips due to change in temperature, an electrical connecting apparatus is used for connection of a tester, and electrical connection terminals of a device under test to undergo electrical test by the tester. The electrical connecting apparatus comprises a probe board having a plurality of probe lands on its underside; and a plurality of contacts having tip portions to be brought into contact with a base end portion fixed at the respective probe lands and the connection terminals of the device under test. The measure from the tip of each contact and the probe land ranges from 1.1 to 1.3 mm, and the coefficient of thermal expansion of the probe board is greater than the coefficient of thermal expansion of the device under test within the range from 1 to 2 ppm/° C.

Abstract: A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.

Abstract: A probe comprises a first and a second arm portions extending in the rightward and leftward direction at a vertical interval, a first and a second connecting portions connecting the first and second arm portions respectively at their front end portion and base end portion, and a needle point portion following one side in the upward and downward direction of the first connecting portion. At least one of the first and second arm portions has at least one of the whole arm portion, an edge portion on one side in the upward and downward direction of the arm portion, and an edge portion on the other side in the upward and downward direction of the arm portion made arcuate.