Patents by Inventor Kiyotsugu KOMORI

Kiyotsugu KOMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AND SOLDER BALL
    Publication number: 20220241903
    Abstract: Provided is a joint structure. The joint structure includes a first structure, and a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy, wherein a thickness of the joint portion is 3 ?m or more and 50 ?m or less.
    Type: Application
    Filed: March 25, 2020
    Publication date: August 4, 2022
    Inventors: Masamoto TANAKA, Kiyotsugu KOMORI, Keisuke AKASHI, Katsuhiko HOSHINO, Tsunekazu YAMAZAKI, Takayuki KOBAYASHI, Sukeyoshi YAMAMOTO, Kensuke MISAWA