Patents by Inventor Kiyoyasu Shibata

Kiyoyasu Shibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and electric apparatus
    Patent number: 7473991
    Abstract: A semiconductor device of an embodiment of the invention has a package substrate, and a semiconductor chip mounted on the package substrate. The semiconductor chip has an output section, and a filter section for decreasing the electromagnetic noise generated from the data communication path. The output section outputs a data signal into the data communication path, and has a buffer amplifier section for compensating the data signal.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: January 6, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shigeru Hiura, Takaya Kitahara, Masanori Kinugasa, Akira Takiba, Masaru Mizuta, Kiyoyasu Shibata
  • SEMICONDUCTOR DEVICE AND ELECTRIC APPARATUS
    Publication number: 20070164788
    Abstract: A semiconductor device of an embodiment of the invention has a package substrate, and a semiconductor chip mounted on the package substrate. The semiconductor chip has an output section, and a filter section for decreasing the electromagnetic noise generated from the data communication path. The output section outputs a data signal into the data communication path, and has a buffer amplifier section for compensating the data signal.
    Type: Application
    Filed: December 21, 2006
    Publication date: July 19, 2007
    Inventors: Shigeru HIURA, Takaya Kitahara, Masanori Kinugasa, Akira Takiba, Masaru Mizuta, Kiyoyasu Shibata