Abstract: A method of quantitatively measuring the adhesive strength of a cover sheet of an electronic component housing container including a main body having multiple housing recesses in a longitudinal direction and a cover sheet peelably adhered to the main body. The method includes mounting the housing container on a carrier plate by fitting the housing recesses in one or more housing holes of the carrier plate which includes a plate body having the one or more housing holes in the longitudinal direction and multiple sprocket holes spaced apart from the housing holes in a width direction and arranged at regular intervals in the longitudinal direction; engaging some tooth tips of a sprocket in the sprocket holes; and peeling the cover sheet from the main body by rotating the sprocket using the width direction as an axis to move the carrier plate in the longitudinal direction.

Abstract: A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91?Dl/De?1.09.

Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.

Abstract: A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91?Dl/De?1.09.

Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.

Abstract: An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

Abstract: A feeder for feeding electronic chip components includes a hopper having a discharge opening at its bottom and having and an aligning path forming member for agitating electronic chip components. The aligning path forming member agitates the electronic chip components by its reciprocating movement within the discharge opening of the hopper. The reciprocating stroke of the aligning path forming member can be varied, and the stroke is controlled to be shorter when the number of electronic chip components remaining in the hopper is reduced. This allows the electronic chip components to be guided more reliably into an aligning path formed by the aligning path forming member, regardless of the number of electronic chip components remaining in the hopper.

Abstract: An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

Abstract: Electronic components can be reliably supplied from a storage container for electronic components, which is easy to manufacture and highly economical, to a mounting device. The storage container for electronic components includes a storage region, in which electronic components are stored, a discharge hole, a lead portion for leading the electronic components to the discharge hole, the end of the lead portion becoming the discharge hole, a discharge hole side lead portion, provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole, and a storage region side lead portion, positioned between the storage region and the discharge hole side lead portion, and provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole side lead portion. In addition, the taper (guide angle) of the storage region side lead portion may be larger than the taper (guide angle) of the discharge hole side lead portion.

Abstract: An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

Abstract: An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

Abstract: At least one partition wall is disposed in a hopper of a feeder for feeding electronic chip components. The at least one partition wall reduces the potential for damage to the components due to the reciprocating movement of a movable pipe disposed on the bottom of the hopper for agitating the electronic chip components. The reduced potential of degradation allows more electronic chip components to be accommodated in the hopper.

Abstract: A feeder for electronic chip components is provided having an aligning path forming member agitating electronic chip components which are to be discharged from a discharge opening of a hopper for accommodating a plurality of electronic chip components. The agitation is achieved by reciprocating the aligning path forming member in the axis direction of the discharge opening and forming a tubular aligning path which receives only the electronic chip components aligned in a predetermined direction therein. When the aligning path forming member reciprocates it also rotates around its axis. This results in an increased agitating effect on electronic chip components for guiding them into the aligning path.