Patents by Inventor Kjell A Heitmann
Kjell A Heitmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7475474Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.Type: GrantFiled: January 10, 2007Date of Patent: January 13, 2009Assignee: Pitney Bowes Inc.Inventors: Kjell A Heitmann, Douglas A Clark, Paul G Perreault
-
Publication number: 20070175023Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.Type: ApplicationFiled: January 10, 2007Publication date: August 2, 2007Inventors: Kjell Heitmann, Douglas Clark, Paul Perreault
-
Publication number: 20070171225Abstract: Active contour models and active shape models were developed for the detection of the kinematics landmarks on sequential back surface measurements. The anatomical landmarks correspond with the spinous process, the dimples of the posterior superior iliac spines (PSIS), the margo mediales and the elbow. Back surface curvatures are used as a basis to guide the ACM and ASM's towards interesting landmark features on the back surface. Geometrical bending and torsion costs, and the main modes of variation of the landmark points are added to the models in order to avoid unrealistic curve shapes from a biomechanical point of view. Reconstruction of the underlying skeletal structures is performed using the surface normals as approximations for skeletal rotations (e.g. axial vertebrae rotations, pelvic torsion, etc.) and anatomical formulas to estimate skeletal dimensions.Type: ApplicationFiled: February 25, 2005Publication date: July 26, 2007Inventors: Bart Haex, Jozef Sloten, Helmut Diers, Kjell Heitmann
-
Patent number: 7180008Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.Type: GrantFiled: June 15, 2004Date of Patent: February 20, 2007Assignee: Pitney Bowes Inc.Inventors: Kjell A Heitmann, Douglas A Clark, Paul G Perreault
-
Patent number: 7156233Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a tamper wrap attached to the printed circuit board. The tamper wrap includes a plurality of side tabs extending from a main body portion and a plurality of corner protection flaps extending from the side tabs. The tamper wrap covers the entirety of a first surface of the printed circuit board and at least a portion of a second surface opposite the first surface of the printed circuit board. Each of the side tabs covers at least a portion of one of the side walls of the printed circuit board and each of the corner flaps is folded around and covers a respective one of the corner edges of the printed circuit board. The printed circuit board may have a plurality of corner sentinels mounted adjacent to the corners of a surface thereof for protecting such corners.Type: GrantFiled: June 15, 2004Date of Patent: January 2, 2007Assignee: Pitney Bowes Inc.Inventors: Douglas A Clark, Kjell A Heitmann, Paul G Perreault
-
Patent number: 6996953Abstract: A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.Type: GrantFiled: June 15, 2004Date of Patent: February 14, 2006Assignee: Pitney Bowes Inc.Inventors: Paul G Perreault, Douglas A Clark, Kjell A Heitmann
-
Publication number: 20060021903Abstract: A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.Type: ApplicationFiled: September 29, 2005Publication date: February 2, 2006Inventors: Paul Perreault, Douglas Clark, Kjell Heitmann
-
Publication number: 20050274630Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a tamper wrap attached to the printed circuit board. The tamper wrap includes a plurality of side tabs extending from a main body portion and a plurality of corner protection flaps extending from the side tabs. The tamper wrap covers the entirety of a first surface of the printed circuit board and at least a portion of a second surface opposite the first surface of the printed circuit board. Each of the side tabs covers at least a portion of one of the side walls of the printed circuit board and each of the corner flaps is folded around and covers a respective one of the corner edges of the printed circuit board. The printed circuit board may have a plurality of corner sentinels mounted adjacent to the corners of a surface thereof for protecting such corners.Type: ApplicationFiled: June 15, 2004Publication date: December 15, 2005Applicant: Pitney Bowes IncorporatedInventors: Douglas Clark, Kjell Heitmann, Paul Perreault
-
Publication number: 20050161253Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.Type: ApplicationFiled: June 15, 2004Publication date: July 28, 2005Applicant: Pitney Bowes IncorporatedInventors: Kjell Heitmann, Douglas Clark, Paul Perreault
-
Publication number: 20050160702Abstract: A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.Type: ApplicationFiled: June 15, 2004Publication date: July 28, 2005Applicant: Pitney Bowes IncorporatedInventors: Paul Perreault, Douglas Clark, Kjell Heitmann
-
Patent number: 5689296Abstract: A circuit connecting device for use with a digital printing apparatus is disclosed, the digital printing apparatus having a jet module assembly, a plurality of ink ejecting devices mounted in the jet module assembly, a corresponding plurality of ink ejecting nozzles formed on a nozzle plate mounted on an exterior of the jet module assembly, conduit means within the jet module assembly communicating between the ink ejecting devices and the nozzles, and a control electronics component for controlling the sequence of activation of the ink ejecting devices to cause ink to be ejected from the nozzles onto an image receiving medium during relative movement between the print head and the image receiving medium.Type: GrantFiled: November 2, 1995Date of Patent: November 18, 1997Assignee: Pitney Bowes Inc.Inventors: Kjell A. Heitmann, Bruce E. Inpyn
-
Patent number: 5242314Abstract: A universal electrical bus connector is disclosed which is multi-functional in serving to connect a power and communications bus passing through the connector to a printed circuit board module to permit tapping into selected wires of the bus for utilization in the module, to connect separate power and communications buses together at any location to extend the bus within a machine harness, and to connect separate power and communications buses together at a printed circuit board module both to extend the bus and permit tapping into selected wires of the extended bus for utilization in the module. The connector includes essentially a housing having a plurality of electrical contact devices which connect between individual wires of a bus and contact areas formed on the surface of the printed circuit board module.Type: GrantFiled: October 8, 1992Date of Patent: September 7, 1993Assignee: Pitney Bowes Inc.Inventors: Peter C. Di Giulio, Kjell A. Heitmann, Edward J. Naclerio