Abstract: A power electronics module and a method of producing a power electronics module. The module includes multiple of power electronic semiconductor chips incorporated in a housing, and a heat transfer structure which forms an outer surface of the module and is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a metallic structure having a soft coating.

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Abstract: The present application relates to a heat transfer structure, power electronics module, cooling element and methods of manufacturing a heat transfer structure and a power electronics component. A heat transfer structure is utilized in a power electronics module. The heat transfer structure includes a metallic body and a carbon based insert.

Abstract: A method for operating a winch and an electric drive for driving a winch including a rotatable winch drum for spooling a spoolable medium and an electric motor operably coupled to the winch drum, the electric drive being configured to drive the winch drum by driving the electric motor such that a tension of the spoolable medium reaches a predetermined tension set point value or value range, and set a driving speed of the electric motor to zero, and after the setting of the driving speed of the electric motor to zero, drive the electric motor to alternate directions of rotation at predetermined driving speeds such that the direction of rotation is changed at a predetermined frequency.

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Abstract: A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.

Abstract: A method of reducing thermal stresses of a semiconductor component in a frequency converter, an arrangement in a frequency converter, and a frequency converter, wherein the semiconductor component is attached to a cooling element for cooling the semiconductor component and one or more resistive elements are attached to the cooling element. In the method, the cooling element is heated by the one or more resistive elements attached thereto by supplying current from the frequency converter through the one or more resistive elements for obtaining an elevated lowest temperature for the semiconductor component and thereby reducing the amount of temperature change between the highest and the lowest temperatures in the semiconductor component during use of the frequency converter.

Abstract: A method of reducing thermal stresses of a semiconductor component in a frequency converter, an arrangement in a frequency converter, and a frequency converter, wherein the semiconductor component is attached to a cooling element for cooling the semiconductor component and one or more resistive elements are attached to the cooling element. In the method, the cooling element is heated by the one or more resistive elements attached thereto by supplying current from the frequency converter through the one or more resistive elements for obtaining an elevated lowest temperature for the semiconductor component and thereby reducing the amount of temperature change between the highest and the lowest temperatures in the semiconductor component during use of the frequency converter.