Abstract: Various embodiments provide for asymmetric data transmissions using one or more efficiency features, which can be used in such applications as data network communications between sensors (e.g., cameras, motion, radar, etc.) and computing equipment within vehicles (e.g., smart and autonomous cars), or data network communications between a media server (e.g., movies or music) and a display device (e.g., one in a passenger compartment of a vehicle).

Abstract: Disclosed are circuits and methods for a comparator with a floating capacitive supply. A capacitor is coupled between a comparator and a power supply. Two sets of electronic switches are configured in opposing operational states to shift the configuration of the circuit between a charging configuration and a decision configuration. In the charging configuration, the capacitor draws current from the power supply. In the decision configuration, the comparator pulls current from the capacitor to perform a decision. The configuration of the two sets of switches is alternated to toggle between the charging configuration and the decision configuration, allowing for the capacitor to be recharged between each decision performed by the comparator.

Abstract: Disclosed are circuits and methods for a CDAC with capacitive references. Individual reference capacitors can be implemented to provide the reference voltages for each input capacitor in a CDAC. For example, each input capacitor may be allocated a high-reference capacitor and a low-reference capacitor to provide the reference voltage to the respective input capacitor. Each of these reference capacitors is charged along with the input capacitor when the CDAC is configured into a loading configuration, and then used to convert digital data to an analog signal when the CDAC is configured into a conversion configuration. Accordingly, the reference voltage for each input capacitor is provided by a separate power source. This contrasts with current solutions in which the reference voltages for the input capacitors are provided by either a singular high-reference voltage source or low-reference voltage source.

Abstract: A differential amplifier includes a positive leg, a negative leg, and biasing circuitry. The positive leg includes at least one positive leg transistor, a first positive leg degeneration capacitor, and positive leg degeneration capacitor biasing circuitry configured to bias the first degeneration capacitor during a reset period. The negative leg includes at least one negative leg transistor, a negative leg degeneration capacitor, and negative leg degeneration capacitor biasing circuitry configured to bias the negative leg degeneration capacitor during the reset period. The biasing circuitry biases current of both the at least one positive leg transistor and the at least one negative leg transistor based on capacitance of the first positive leg degeneration capacitor, capacitance of the first negative leg degeneration capacitor, and a sampling time during an amplification period. The differential amplifier may be a stage amplifier in an Analog to Digital Converter (ADC).

Abstract: A differential amplifier includes a positive leg, a negative leg, and biasing circuitry. The positive leg includes at least one positive leg transistor, a first positive leg degeneration capacitor, and positive leg degeneration capacitor biasing circuitry configured to bias the first degeneration capacitor during a reset period. The negative leg includes at least one negative leg transistor, a negative leg degeneration capacitor, and negative leg degeneration capacitor biasing circuitry configured to bias the negative leg degeneration capacitor during the reset period. The biasing circuitry biases current of both the at least one positive leg transistor and the at least one negative leg transistor based on capacitance of the first positive leg degeneration capacitor, capacitance of the first negative leg degeneration capacitor, and a sampling time during an amplification period. The differential amplifier may be a stage amplifier in an Analog to Digital Converter (ADC).

Abstract: A semiconductor device fabrication operation is commonly used to manufacture one or more integrated circuits onto a semiconductor substrate. The semiconductor device fabrication operation forms one or more transistors onto an arrangement of fabrication layers to form the one or more integrated circuits which introduces unwanted capacitances, often referred to as parasitic capacitances, into the one or more transistors. The one or more integrated circuits include one or more compensation modules that, when combined with the parasitic capacitances of the one or more transistors, ideally linearizes the non-linearity caused by the parasitic capacitances of the one or more transistors. For example, the one or more compensation modules incorporate a non-linear or a piecewise linear transfer function that is inversely related to the parasitic capacitances of the one or more transistors.

Abstract: A semiconductor device fabrication operation is commonly used to manufacture one or more integrated circuits onto a semiconductor substrate. The semiconductor device fabrication operation forms one or more transistors onto an arrangement of fabrication layers to form the one or more integrated circuits which introduces unwanted capacitances, often referred to as parasitic capacitances, into the one or more transistors. The one or more integrated circuits include one or more compensation modules that, when combined with the parasitic capacitances of the one or more transistors, ideally linearizes the non-linearity caused by the parasitic capacitances of the one or more transistors. For example, the one or more compensation modules incorporate a non-linear or a piecewise linear transfer function that is inversely related to the parasitic capacitances of the one or more transistors.

Abstract: An integrated communications system. Comprising a substrate having a receiver disposed on the substrate for converting a received signal to an IF signal. Coupled to a VGA for low voltage applications and coupled to the receiver for processing the IF signal. The VGA includes a bank pair having a first bank of differential pairs of transistors and a second bank of differential pairs of transistors. The bank pair is cross-coupled in parallel, the IF signal is applied to the bank pair decoupled from a control signal used to control transconductance output gain of the bank pair over a range of input voltages. A digital IF demodulator is disposed on the substrate and coupled to the VGA for low voltage applications, for converting the IF signal to a demodulated baseband signal. And a transmitter is disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.

Abstract: Circuitry to remove switches from signal paths in integrated circuit programmable gain attenuators. Programmable gain attenuators and programmable gain amplifiers commonly switch between signal levels using semi-conductor switches. Such switches may introduce non-linearities in the signal. By isolating the switches from the signal path linearity of the PGA can be improved.

Abstract: A multi-lane analog-to-digital converter (ADC) is disclosed that is capable of compensating for one or more of its impairments such that its digital output accurately represents its analog input. The multi-lane ADC can compensate for unwanted phase offsets between multiple phases of a sampling clock used by the multi-lane ADC, unwanted bandwidth mismatches between lanes in the multi-lane ADC, and/or unwanted gain mismatches between the lanes in the multi-lane ADC to provide some examples.

Abstract: A multi-lane analog-to-digital converter (ADC) is disclosed that is capable of compensating for one or more of its impairments such that its digital output accurately represents its analog input. The multi-lane ADC can compensate for unwanted phase offsets between multiple phases of a sampling clock used by the multi-lane ADC, unwanted bandwidth mismatches between lanes in the multi-lane ADC, and/or unwanted gain mismatches between the lanes in the multi-lane ADC to provide some examples.

Abstract: An integrated communications system. Comprising a substrate having a receiver disposed on the substrate for converting a received signal to an IF signal. Coupled to a VGA for low voltage applications and coupled to the receiver for processing the IF signal. The VGA includes a bank pair having a first bank of differential pairs of transistors and a second bank of differential pairs of transistors. The bank pair is cross-coupled in parallel, the IF signal is applied to the bank pair decoupled from a control signal used to control transconductance output gain of the bank pair over a range of input voltages. A digital IF demodulator is disposed on the substrate and coupled to the VGA for low voltage applications, for converting the IF signal to a demodulated baseband signal. And a transmitter is disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.

Abstract: An integrated communications system. Comprising a substrate having a receiver disposed on the substrate for converting a received signal to an IF signal. Coupled to a VGA for low voltage applications and coupled to the receiver for processing the IF signal. The VGA includes a bank pair having a first bank of differential pairs of transistors and a second bank of differential pairs of transistors. The bank pair is cross-coupled in parallel, the IF signal is applied to the bank pair decoupled from a control signal used to control transconductance output gain of the bank pair over a range of input voltages. A digital IF demodulator is disposed on the substrate and coupled to the VGA for low voltage applications, for converting the IF signal to a demodulated baseband signal. And a transmitter is disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.

Abstract: In a latch circuit having a bistable pair of cross connected transistors of a first polarity and a third transistor of a second polarity, a current signal greater than a bias current is received at a latch circuit port, amplified with the third transistor, and applied to the latch circuit port. This decreases the time in which the latch circuit port receiving the current signal greater than the bias current reaches a steady state voltage.

Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.

Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.

Abstract: An integrated communications system. Comprising a substrate having a receiver disposed on the substrate for converting a received signal to an IF signal. Coupled to a VGA for low voltage applications and coupled to the receiver for processing the IF signal. The VGA includes a bank pair having a first bank of differential pairs of transistors and a second bank of differential pairs of transistors. The bank pair is cross-coupled in parallel, the IF signal is applied to the bank pair decoupled from a control signal used to control transconductance output gain of the bank pair over a range of input voltages. A digital IF demodulator is disposed on the substrate and coupled to the VGA for low voltage applications, for converting the IF signal to a demodulated baseband signal. And a transmitter is disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.

Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.

Abstract: In a latch circuit having a bistable pair of cross connected transistors of a first polarity and a third transistor of a second polarity, a current signal greater than a bias current is received at a latch circuit port, amplified with the third transistor, and applied to the latch circuit port. This decreases the time in which the latch circuit port receiving the current signal greater than the bias current reaches a steady state voltage.

Abstract: An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator.