Abstract: A manufacturing method includes the follow steps. Firstly, a carrier is provided. Then, a plurality of traces are formed on the carrier. Then, a trace molding compound layer is formed on the carrier by a first molding process. Then, the carrier is removed from the trace molding compound layer to expose an etched surface of the trace molding compound layer and trace upper surfaces of the traces. Then, at least a chip is disposed on the etched surface of the trace molding compound layer and the chip is connected to the trace upper surfaces. Then, a chip molding compound layer is formed on the etched surface by a second molding process substantially similar to the first molding process, wherein the chip molding compound layer and the trace molding compound layer are formed of substantially the same molding compound material.

Abstract: A semiconductor package, a method for manufacturing the semiconductor package, a trace substrate and a method for manufacturing the trace substrate are provided. The semiconductor package includes a trace substrate, a chip and a plurality of wires. The trace substrate includes a plurality of trace, a plurality of conductive studs, a plurality of traces pads and a trace modling compound. The conductive studs are formed on the lower surfaces of the traces. The trace modling compound encapsulates the conductive studs and the trace, and exposes the lower surfaces of the conductive studs and the upper surfaces of the traces. The chip is disposed on the trace substrate, and the wires electrically connect the chip and the trace pads. The trace pads are not overlapping to the conductive studs.