Abstract: A method and system are provided for controlling processing of a structure. First measured data is provided being indicative of at least one of: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to processing of the structure, and a surface profile of the structure prior to processing. An optical measurement is applied to at least the selected sites of the structure after processing and second measured data is generated being indicative of at least one of: a thickness of the processed structure (d?) and a surface profile of the processed structure. The second measured data is analyzed by interpreting it using the first measured data to determine a thickness (d?1 or d?2) of at least one layer of the processed structure. This determined thickness is indicative of the quality of processing.

Abstract: A method and system are provided for controlling processing of a structure. First measured data is provided being indicative of at least one of: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to processing of the structure, and a surface profile of the structure prior to processing. An optical measurement is applied to at least the selected sites of the structure after processing and second measured data is generated being indicative of at least one of: a thickness of the processed structure (d?) and a surface profile of the processed structure. The second measured data is analyzed by interpreting it using the first measured data to determine a thickness (d?1 or d?2) of at least one layer of the processed structure. This determined thickness is indicative of the quality of processing.

Abstract: A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to processing. An optical measurement is applied to at least the selected sites of the structure after processing and second measured data is generated being indicative of at least one of the following: a thickness of the process structure (d?) and a surface profile of the processed structure. The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d?1 or d?2) of at least one layer of the process structure. This determined thickness is thus indicative of the quality of the processing.

Abstract: A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to said processing. An optical measurement is applied to at least the selected sites of the structure after said processing and second measured data is generated being indicative of at least one of the following: a thickness of the processed structure (d?) and a surface profile of the processed structure, The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d?1 or d?2) of at least one layer of the processed structure. This determined thickness is thus indicative of the quality of said processing.

Abstract: A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to said processing. An optical measurement is applied to at least the selected sites of the structure after said processing and second measured data is generated being indicative of at least one of the following: a thickness of the processed structure (d?) and a surface profile of the processed structure, The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d?1 or d?2) of at least one layer of the processed structure. This determined thickness is thus indicative of the quality of said processing.

Abstract: A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to said processing. An optical measurement is applied to at least the selected sites of the structure after said processing and second measured data is generated being indicative of at least one of the following: a thickness of the processed structure (d?) and a surface profile of the processed structure, The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d?1 or d?2) of at least one layer of the processed structure. This determined thickness is thus indicative of the quality of said processing.

Abstract: A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to said processing. An optical measurement is applied to at least the selected sites of the structure after said processing and second measured data is generated being indicative of at least one of the following: a thickness of the processed structure (d?) and a surface profile of the processed structure, The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d?1 or d?2) of at least one layer of the processed structure. This determined thickness is thus indicative of the quality of said processing.

Abstract: A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at least selected sites of the structure prior to the processing of the structure, and a surface profile of the structure prior to said processing. An optical measurement is applied to at least the selected sites of the structure after said processing and second measured data is generated being indicative of at least one of the following: a thickness of the processed structure (d′) and a surface profile of the processed structure, The second measured data is analyzed by interpreting it using the first measured data to thereby determine a thickness (d′1 or d′2) of at least one layer of the processed structure. This determined thickness is thus indicative of the quality of said processing.

Abstract: A beam polarizer device for splitting an unpolarized beam of incident radiation into first and second beams of different polarizations. The beam polarizer comprises a birefringent cell interposed between a pair of parallel sides of first and second prisms made of an optically transparent material. The birefringent cell is formed of an oriented organic material having a desired orientation of its optical axis relative to the sides of the prisms enclosing the birefringent cell therebetween. The organic material has substantially different refraction indices n1 and n2 for light components of, respectively, two different orientations of electric fields relative to the direction of propagation of a beam impinging onto the birefringent cell while propagating inside the first prism. The optically transparent material has a refraction index n3 which is substantially equal to the greatest one between the refraction indices n1 and n2.

Abstract: A light-modulating cell for providing a desired propagation of light impinging thereon is presented. The cell comprises at least two substrates, made a material substantially optically transparent with respect to incident radiation of a desired wavelength range, and at least one reservoir attached to at least one of the substrates. These at least two substrates define a plurality of spaced-apart outer surfaces and a sealed therebetween, respectively. The space is filled with a first, substantially liquid light-modulating medium, while the reservoir contains predetermined amount of a second, substantially liquid light-modulating medium. The inside of the reservoir is connected to the inside of the sealed space for providing a continuous flow of the first and second media into and out of the space.