Patents by Inventor Klaus B. Roithner

Klaus B. Roithner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Etch profile shaping through wafer temperature control
    Patent number: 5605600
    Abstract: In a method of etch profile shaping through wafer temperature control during an etch process wherein deposition of a passivation film is temperature dependent, a gap between a semiconductor wafer to be etched and a cathode is pressurized at a first pressure, and the pressure in the gap is changed to a second pressure at a predetermined time during the etch process, thereby altering heat transfer from the semiconductor wafer to the cathode. The temperature of the wafer is adjusted one or more times during an etching process to control profile shaping of deep trenches, contact holes and shapes for mask opening shaping during the etch process.
    Type: Grant
    Filed: March 13, 1995
    Date of Patent: February 25, 1997
    Assignees: International Business Machines Corporation, Siemens Aktiengesellshaft, Kabushiki Kaisha Toshiba
    Inventors: Karl P. Muller, Klaus B. Roithner, Bernhard Poschenrieder, Toru Watanabe