Patents by Inventor Klaus Bednorz

Klaus Bednorz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5290366
    Abstract: A laminated solar module has two spatially-separated electrical terminals with a simple cabling of a plurality of such solar modules to one another. The solar modules are weather proof. A respective housing is located at each electrical terminal. A protective diode is integrated in at least one housing as a normally-non-conducting diode bridging solar cells that are arranged in the solar module and connected in series.
    Type: Grant
    Filed: March 16, 1993
    Date of Patent: March 1, 1994
    Assignee: Siemens Solar GmH
    Inventors: Manfred Riermeier, Klaus Bednorz
  • Patent number: 5043024
    Abstract: Solar cell equipment is mounted using clamps of the present invention. The clamps enable a single mounting which may be employed in conjunction with a frame. The clamps provide electrical contact to the solar cell equipment for carrying the solar generated current. Clamps may also be completely insulated from the solar cell equipment. The clamps provide mechanical stabilization for the solar cell equipment.
    Type: Grant
    Filed: December 6, 1989
    Date of Patent: August 27, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Fritz Cammerer, Klaus Bednorz, Manfred Riermeier
  • Patent number: 4567316
    Abstract: A solar cell module assembly includes a solar cell module including individual solar cells disposed in rows and at least partly electrically interconnected in series, and at least one bypass diode shunted across at least some of the series-connected solar cells, the at least one diode being normally cut off during operation of the solar cell module and the at least one diode being directly integrated into the solar cell module.
    Type: Grant
    Filed: February 27, 1984
    Date of Patent: January 28, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhard Hollaus, Rudolf Zehetbauer, Klaus Bednorz
  • Patent number: 4104676
    Abstract: The present invention is directed to a semiconductor device comprising a body of semiconductor material having at least one p-n junction therein. The body of semiconductor material has opposed, flat, substantially parallel main faces and an edge portion extending between the two main faces. The p-n junction is exposed at the edge portion of the body. Metal electrodes are affixed to at least a portion of the two faces of the body of semiconductor material. A layer of protective material covers the edge portion, the metal electrodes, and any exposed portions of the two main faces of the body. Electrical contacts made to the body of semiconductor material by lead electrodes in compression bonded contact with the metal electrodes and in some cases with at least a portion of the main faces of the body of semiconductor material. The surface of the lead electrodes in contact with the metal electrodes and in some instances the main faces of the semiconductor body is comprised of a plurality of lands and grooves.
    Type: Grant
    Filed: December 13, 1976
    Date of Patent: August 1, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus Bednorz, Jon W. Johansen, Fritz Scheidel