Abstract: An addressable receptor in laminate form, and advantageously in PTF laminate form, comprising a front conductive layer including a plurality of substantially parallel front electrode strips and a rear conductive layer also including a plurality of substantially parallel rear electrode strips. The conductive layers are orientated with respect to each other so that an array of electrode regions of intersection is formed corresponding to the regions at which the front electrode strips cross over the rear electrode strips. The first and second conductive layers are separated by a reactive layer comprising a plurality of defined reactive regions. The reactive regions are deployed in a reactive array substantially in register with the array of electrode regions of intersection, so that the reactive regions are electrically addressable by coordinate pairs of first and second electrode strips. The front electrode strips are partially transparent to radiation in a selected waveband.

Abstract: A building for the manufacture of integrated circuits which includes a manufacturing equipment floor with processing equipment for the manufacture of integrated circuits, a floor under the manufacturing floor has supporting equipment associated with each of the processing equipment, and an upper floor above the manufacturing floow supports a plenum system that provides at least two classes of clean air circulation to the manufacturing floor. Each piece of processing equipment is enclosed with means to separate it from the surrounding air. A clean air input of the highest class of clean air purity is provided to the processing equipment in the enclosure. The air/gas exhaust is directed through an air/gas handling system. Means are also provided to provide the surrounding areas a clean air input of a lower class of clean air purity from the plenum system and the air/gas exhaust directed to an air/gas handling system.

Abstract: A fast response temperature sensing device particularly adapted for use in a rarefied fluid media comprises a body of semiconducting material having a precisely predetermined positive temperature coefficient of resistivity in a selected temperature range. The body has ohmic contact element secured thereto to form a small spreading resistance type of resistor element having precisely predetermined resistance characteristics. Leads are electrically connected to the element for connecting the element in an electrical circuit. The element is encapsulated for shielding the element from the environment in a temperature zone to be monitored; and a vane having greater thermal conductivity than the encapsulating material and having greater heat capacity than the resistor element are secured in heat-transfer relation to the element to extend outside the encapsulating material for rapidly conducting heat to the resistor element from the temperature zone.

Abstract: An axial-lead fixed-value capacitor comprising a metal-nitride-oxide-silicon chip in a standard diode package has been fabricated, having capacitance values in the 10 to 1000 pico-farad range. The device features a beveled-edge configuration which contributes to a low leakage current and also facilitates the sealing of the semiconductor chip in a double plug axial-lead package. The double layer dielectric medium comprises a thermally grown silicon oxide film typically 450 angstroms thick, for example, and a plasma deposited layer of silicon nitride typically 350 angstroms thick, for example.

Abstract: An axial-lead fixed-value capacitor comprising a metal-nitride-oxide-silicon chip in a standard diode package has been fabricated, having capacitance values in the 10 to 1000 pico-farad range. The device features a beveled-edge configuration which contributes to a low leakage current and also facilitates the sealing of the semiconductor chip in a double plug axial-lead package. The double layer dielectric medium comprises a thermally grown silicon oxide film typically 450 angstroms thick, for example, and a plasma deposited layer of silicon nitride typically 350 angstroms thick, for example.