Patents by Inventor Klaus-D Vissing

Klaus-D Vissing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
    Patent number: 8173522
    Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: May 8, 2012
    Assignee: Thin Materials AG
    Inventors: Andreas Jakob, Klaus-D Vissing, Volkmar Stenzel
  • Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
    Publication number: 20090176349
    Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
    Type: Application
    Filed: January 26, 2009
    Publication date: July 9, 2009
    Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Andreas JAKOB, Klaus-D VISSING, Volkmar STENZEL
  • Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
    Patent number: 7482249
    Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: January 27, 2009
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Andreas Jakob, Klaus-D. Vissing, Volkmar Stenzel
  • Article having a plasmapolymer coating and method for producing the same
    Patent number: 7157145
    Abstract: An article is described comprising a substrate and a plasma polymer coating comprising silicon, oxygen and carbon bonded to the surface of the substrate, in respect of which coating the following applies in the case of determination by means of ESCA: the mole ratio O: Si is >1.25 and <2.6 and the mole ratio C: Si is >0.6 and <2.2, according to a preferred embodiment the coating contains at least 22 and at most 27 atomic percent Si, at least 25 and at most 50 atomic percent O and at least 25 and at most 50 atomic percent C based on its total atomic number without hydrogen and/or fluorine.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: January 2, 2007
    Assignee: Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
    Inventors: Klaus D. Vissing, Guido Ellinghorst, Gabriele Neese
  • Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
    Publication number: 20060166464
    Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
    Type: Application
    Filed: November 28, 2003
    Publication date: July 27, 2006
    Applicant: Fraunhofer Gesellschaft zur Forderung der ...
    Inventors: Andreas Jakob, Klaus-D. Vissing, Volkmar Stenzel
  • Method for producing a permanent demoulding layer by plasma polymerization on the surface of a moulded-part tool, a moulded-part tool produced by said method and the use thereof
    Patent number: 6949272
    Abstract: A method of producing a permanent demoulding layer by plasma polymerisation on the surface of a mould, in which a gradient layer structure is created in the demoulding layer by varying the polymerisation conditions over time.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: September 27, 2005
    Assignee: ACMOS Chemie GmbH & Co.
    Inventors: Horst Wochnowski, Holger Klyszcz-Nasko, Alfred Baalmann, Klaus-D Vissing
  • Method and device for plasma coating surfaces
    Patent number: 6800336
    Abstract: A method for coating surfaces, for which a precursor material is caused to react with the help of plasma and the reaction product is deposited on a surface, the reaction as well as the deposition taking place at atmospheric pressure, such that a plasma jet is generated by passing a working gas through an excitation zone and the precursor material is supplied with a lance separately from the working gas to the plasma jet.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: October 5, 2004
    Inventors: Peter Förnsel, Christian Buske, Uwe Hartmann, Alfred Baalmann, Guido Ellinghorst, Klaus D Vissing
  • Article having a plasmapolymer coating and method for producing the same
    Publication number: 20040180210
    Abstract: An article is described comprising
    Type: Application
    Filed: December 22, 2003
    Publication date: September 16, 2004
    Inventors: Klaus D Vissing, Guido Ellinghorst, Gabriele Neese
  • Method for producing a permanent demoulding layer by plasma polymerization on the surface of a moulded-part tool, a moulded-part tool produced by said method and the use thereof
    Publication number: 20030175525
    Abstract: A method of producing a permanent demoulding layer by plasma polymerisation on the surface of a mould, in which a gradient layer structure is created in the demoulding layer by varying the polymerisation conditions over time.
    Type: Application
    Filed: May 13, 2003
    Publication date: September 18, 2003
    Inventors: Horst Wochnowski, Holger Klyszcz-Nasko, Alfred Baalmann, Klaus-D Vissing