Abstract: Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

Abstract: A wafer-level packaging based module includes an antenna board and a chip board. The antenna board includes at least one antenna layer with introduced antenna element and a shielding layer with introduced shielding element in the area of the at least one antenna element opposite to the antenna layer. The chip board includes a contacting layer, a rewiring layer opposite to the contacting layer and the shielding layer having at least one shielding element arranged on the rewiring layer. A chip layer having at least one chip is arranged between the contacting layer and the rewiring layer. Further, the chip layer includes at least one via connecting the contacting layer to the rewiring layer.

Abstract: A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.

Abstract: The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.

Abstract: An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.

Abstract: An antenna apparatus is provided, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.

Abstract: Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

Abstract: A biosensor has the following components: a sensor base with an insulating substrate and at least one electrically conductive working electrode arranged thereon, in particular formed from separately controllable interdigital electrodes, reduced graphene applied to at least one working electrode, a spacer covalently bound to the reduced graphene, and an antibody fragment Fab covalently bound to the spacer. There is also described a process for producing the biosensor, a biochip equipped with the sensor and a method of detecting an analyte using the biosensor/biochip.

Abstract: A module unit includes a carrier substrate, an antenna substrate as well as sealants. The carrier substrate includes a chip arranged on a first main surface as well as a spacer arranged on the first main surface. The antenna substrate includes at least one antenna structure. The sealants hermetically seal off the antenna substrate and the carrier substrate in an edge area and connect same to each other. The antenna substrate is connected to the carrier substrate via the spacer, so that a cavity is formed between the chip and the antenna substrate.

Abstract: A wafer-level packaging based module includes an antenna board and a chip board. The antenna board includes at least one antenna layer with introduced antenna element and a shielding layer with introduced shielding element in the area of the at least one antenna element opposite to the antenna layer. The chip board includes a contacting layer, a rewiring layer opposite to the contacting layer and the shielding layer having at least one shielding element arranged on the rewiring layer. A chip layer having at least one chip is arranged between the contacting layer and the rewiring layer. Further, the chip layer includes at least one via connecting the contacting layer to the rewiring layer.

Abstract: The invention refers to an antenna apparatus, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.

Abstract: The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.

Abstract: An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.

Abstract: A module unit includes a carrier substrate, an antenna substrate as well as sealants. The carrier substrate includes a chip arranged on a first main surface as well as a spacer arranged on the first main surface. The antenna substrate includes at least one antenna structure. The sealants hermetically seal off the antenna substrate and the carrier substrate in an edge area and connect same to each other. The antenna substrate is connected to the carrier substrate via the spacer, so that a cavity is formed between the chip and the antenna substrate.

Abstract: A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.

Abstract: A biosensor has the following components: a sensor base with an insulating substrate and at least one electrically conductive working electrode arranged thereon, in particular formed from separately controllable interdigital electrodes, reduced graphene applied to at least one working electrode, a spacer covalently bound to the reduced graphene, and an antibody fragment Fab covalently bound to the spacer. There is also described a process for producing the biosensor, a biochip equipped with the sensor and a method of detecting an analyte using the biosensor/biochip.

Abstract: An apparatus and a method for determining an antenna characteristic of an antenna under test in free space is disclosed. Measurement results of a transmitted power of a measurement signal transmitted between the reference antenna and an antenna under test are detected, wherein detecting takes place in the frequency domain. The detected measurement results are transformed into the time domain and a time-domain filter is applied to the measurement results converted into the time domain. A filter width of the time-domain filter is determined in dependence on a spatial distance between the reference antenna and the antenna under test. Measurement result portions that result due to a multipath propagation of the measurement signal between the reference antenna and the antenna under test are reduced or removed.

Abstract: An apparatus and a method for determining an antenna characteristic of an antenna under test in free space is disclosed. Measurement results of a transmitted power of a measurement signal transmitted between the reference antenna and an antenna under test are detected, wherein detecting takes place in the frequency domain. The detected measurement results are transformed into the time domain and a time-domain filter is applied to the measurement results converted into the time domain. A filter width of the time-domain filter is determined in dependence on a spatial distance between the reference antenna and the antenna under test. Measurement result portions that result due to a multipath propagation of the measurement signal between the reference antenna and the antenna under test are reduced or removed.

Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.

Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.