Patents by Inventor Klaus-Dieter Lang

Klaus-Dieter Lang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11328987
    Abstract: A wafer-level packaging based module includes an antenna board and a chip board. The antenna board includes at least one antenna layer with introduced antenna element and a shielding layer with introduced shielding element in the area of the at least one antenna element opposite to the antenna layer. The chip board includes a contacting layer, a rewiring layer opposite to the contacting layer and the shielding layer having at least one shielding element arranged on the rewiring layer. A chip layer having at least one chip is arranged between the contacting layer and the rewiring layer. Further, the chip layer includes at least one via connecting the contacting layer to the rewiring layer.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: May 10, 2022
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ivan Ndip, Tanja Braun, Klaus-Dieter Lang
  • Patent number: 11330699
    Abstract: Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: May 10, 2022
    Assignees: San Diego State University Research Foundation, Kyocera International, Inc., Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Arif Ege Engin, Gerardo Aguirre, Klaus-Dieter Lang, Ivan Ndip
  • Patent number: 11283166
    Abstract: A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: March 22, 2022
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ivan Ndip, Kai Zoschke, Klaus-Dieter Lang
  • Patent number: 11271297
    Abstract: The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: March 8, 2022
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ivan Ndip, Christine Kallmayer, Klaus-Dieter Lang
  • Patent number: 11177569
    Abstract: An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: November 16, 2021
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ivan Ndip, Christine Kallmayer, Klaus-Dieter Lang
  • Patent number: 11114752
    Abstract: An antenna apparatus is provided, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: September 7, 2021
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ivan Ndip, Christine Kallmayer, Klaus-Dieter Lang
  • Publication number: 20210153341
    Abstract: Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.
    Type: Application
    Filed: December 14, 2017
    Publication date: May 20, 2021
    Inventors: Arif Ege ENGIN, Gerardo AGUIRRE, Klaus-Dieter LANG, Ivan NDIP
  • Patent number: 10989684
    Abstract: A biosensor has the following components: a sensor base with an insulating substrate and at least one electrically conductive working electrode arranged thereon, in particular formed from separately controllable interdigital electrodes, reduced graphene applied to at least one working electrode, a spacer covalently bound to the reduced graphene, and an antibody fragment Fab covalently bound to the spacer. There is also described a process for producing the biosensor, a biochip equipped with the sensor and a method of detecting an analyte using the biosensor/biochip.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: April 27, 2021
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Niels Grabbert, Vera Meyer, Klaus-Dieter Lang, Markus Fiedler
  • Patent number: 10903560
    Abstract: A module unit includes a carrier substrate, an antenna substrate as well as sealants. The carrier substrate includes a chip arranged on a first main surface as well as a spacer arranged on the first main surface. The antenna substrate includes at least one antenna structure. The sealants hermetically seal off the antenna substrate and the carrier substrate in an edge area and connect same to each other. The antenna substrate is connected to the carrier substrate via the spacer, so that a cavity is formed between the chip and the antenna substrate.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: January 26, 2021
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Thomas Loeher, Ivan Ndip, Klaus-Dieter Lang
  • Publication number: 20200176376
    Abstract: A wafer-level packaging based module includes an antenna board and a chip board. The antenna board includes at least one antenna layer with introduced antenna element and a shielding layer with introduced shielding element in the area of the at least one antenna element opposite to the antenna layer. The chip board includes a contacting layer, a rewiring layer opposite to the contacting layer and the shielding layer having at least one shielding element arranged on the rewiring layer. A chip layer having at least one chip is arranged between the contacting layer and the rewiring layer. Further, the chip layer includes at least one via connecting the contacting layer to the rewiring layer.
    Type: Application
    Filed: November 26, 2019
    Publication date: June 4, 2020
    Inventors: Ivan NDIP, Tanja BRAUN, Klaus-Dieter LANG
  • Publication number: 20200144710
    Abstract: The invention refers to an antenna apparatus, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.
    Type: Application
    Filed: November 6, 2019
    Publication date: May 7, 2020
    Inventors: Ivan NDIP, Christine KALLMAYER, Klaus-Dieter LANG
  • Publication number: 20200144709
    Abstract: The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.
    Type: Application
    Filed: November 4, 2019
    Publication date: May 7, 2020
    Inventors: Ivan NDIP, Christine KALLMAYER, Klaus-Dieter LANG
  • Publication number: 20200144721
    Abstract: An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.
    Type: Application
    Filed: November 6, 2019
    Publication date: May 7, 2020
    Inventors: Ivan NDIP, Christine KALLMAYER, Klaus-Dieter LANG
  • Publication number: 20190319349
    Abstract: A module unit includes a carrier substrate, an antenna substrate as well as sealants. The carrier substrate includes a chip arranged on a first main surface as well as a spacer arranged on the first main surface. The antenna substrate includes at least one antenna structure. The sealants hermetically seal off the antenna substrate and the carrier substrate in an edge area and connect same to each other. The antenna substrate is connected to the carrier substrate via the spacer, so that a cavity is formed between the chip and the antenna substrate.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 17, 2019
    Inventors: Thomas LOEHER, Ivan NDIP, Klaus-Dieter LANG
  • Publication number: 20190252772
    Abstract: A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 15, 2019
    Inventors: Ivan NDIP, Kai ZOSCHKE, Klaus-Dieter LANG
  • Publication number: 20190187090
    Abstract: A biosensor has the following components: a sensor base with an insulating substrate and at least one electrically conductive working electrode arranged thereon, in particular formed from separately controllable interdigital electrodes, reduced graphene applied to at least one working electrode, a spacer covalently bound to the reduced graphene, and an antibody fragment Fab covalently bound to the spacer. There is also described a process for producing the biosensor, a biochip equipped with the sensor and a method of detecting an analyte using the biosensor/biochip.
    Type: Application
    Filed: May 12, 2017
    Publication date: June 20, 2019
    Applicant: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventors: Niels GRABBERT, Vera MEYER, Klaus-Dieter LANG, Markus FIEDLER
  • Patent number: 10151783
    Abstract: An apparatus and a method for determining an antenna characteristic of an antenna under test in free space is disclosed. Measurement results of a transmitted power of a measurement signal transmitted between the reference antenna and an antenna under test are detected, wherein detecting takes place in the frequency domain. The detected measurement results are transformed into the time domain and a time-domain filter is applied to the measurement results converted into the time domain. A filter width of the time-domain filter is determined in dependence on a spatial distance between the reference antenna and the antenna under test. Measurement result portions that result due to a multipath propagation of the measurement signal between the reference antenna and the antenna under test are reduced or removed.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 11, 2018
    Assignees: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Technische Universitaet Berlin
    Inventors: Ivan Ndip, Volker Grosser, Christian Tschoban, Brian Curran, Max Huhn, Klaus-Dieter Lang
  • Publication number: 20180088162
    Abstract: An apparatus and a method for determining an antenna characteristic of an antenna under test in free space is disclosed. Measurement results of a transmitted power of a measurement signal transmitted between the reference antenna and an antenna under test are detected, wherein detecting takes place in the frequency domain. The detected measurement results are transformed into the time domain and a time-domain filter is applied to the measurement results converted into the time domain. A filter width of the time-domain filter is determined in dependence on a spatial distance between the reference antenna and the antenna under test. Measurement result portions that result due to a multipath propagation of the measurement signal between the reference antenna and the antenna under test are reduced or removed.
    Type: Application
    Filed: September 29, 2017
    Publication date: March 29, 2018
    Applicants: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Technische Universitaet Berlin
    Inventors: Ivan Ndip, Volker Grosser, Christian Tschoban, Brian Curran, Max Huhn, Klaus-Dieter Lang
  • Patent number: 8020746
    Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: September 20, 2011
    Assignees: Technische Universitaet Berlin, Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Ute Geissler, Herbert Reichl, Holger Gaul, Klaus-Dieter Lang, Martin Schneider-Ramelow
  • Publication number: 20100025453
    Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.
    Type: Application
    Filed: September 4, 2007
    Publication date: February 4, 2010
    Applicants: TECHNISCHE UNIVERSITAET BERLIN, FRAUNHOFER-GESELLSCHAFT ZUR FOEDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Ute Geissler, Herbert Reichl, Holger Gaul, Klaus-Dieter Lang, Martin Schneider-Ramelow