Abstract: An imaging interferometer includes optics defining an interferometric cavity, in which the optics include a first beam-splitting optic positioned to separate an input beam into a test beam and a reference beam, a second beam-splitting optic positioned to transmit the test beam to the test surface, receive the test beam back from the test surface, and thereafter recombine the test beam with the reference beam, and a third optic positioned to direct the reference beam from the first optic to the second optic. The interferometric cavity defines a virtual reference surface positioned along a path for the reference beam between the second and third optics. The interferometer also includes an imaging channel positioned to receive the recombined test and reference beams, where the imaging channel includes an imaging detector, and at least one imaging element configured to image the test surface and the virtual reference surface onto the detector.

Abstract: An imaging interferometer includes optics defining an interferometric cavity, in which the optics include a first beam-splitting optic positioned to separate an input beam into a test beam and a reference beam, a second beam-splitting optic positioned to transmit the test beam to the test surface, receive the test beam back from the test surface, and thereafter recombine the test beam with the reference beam, and a third optic positioned to direct the reference beam from the first optic to the second optic. The interferometric cavity defines a virtual reference surface positioned along a path for the reference beam between the second and third optics. The interferometer also includes an imaging channel positioned to receive the recombined test and reference beams, where the imaging channel includes an imaging detector, and at least one imaging element configured to image the test surface and the virtual reference surface onto the detector.

Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.

Abstract: A method and apparatus for analyzing a surface of a test object employs apparatus with a scanning interferometry system which generates a windowed interferometric signal from the surface of a test object to characterize the surface of the test object.

Abstract: Apparatus and methods are provided for analyzing surface characteristics of a test object using broadband scanning interferometry. Test objects amenable to these apparatus and methods include but are not limited to semiconductor wafers, semiconductor devices, metallic surfaces, and the like. An interferometry system is used to obtain an interferometry signal and related to data embodied in the signal representative of the test object surface. This signal and/or data is used to construct an n-dimensional function that includes an independent frequency variable and an independent time variable, and/or an n-dimensional function that includes an independent scale variable and an independent time variable, and/or a multi-domain function. These functions are compared with various models to obtain a best match that is then used to characterize the test object surface.

Abstract: Apparatus and methods are provided for analyzing surface characteristics of a test object using broadband scanning interferometry. Test objects amenable to these apparatus and methods include but are not limited to semiconductor wafers, semiconductor devices, metallic surfaces, and the like. An interferometry system is used to obtain an interferometry signal and related to data embodied in the signal representative of the test object surface. This signal and/or data is used to construct an n-dimensional function that includes an independent frequency variable and an independent time variable, and/or an n-dimensional function that includes an independent scale variable and an independent time variable, and/or a multi-domain function. These functions are compared with various models to obtain a best match that is then used to characterize the test object surface.

Abstract: The present invention consists of a technique and device for measuring the thickness variation and shape of wafers or other polished opaque plates. A combination of two improved phase-shifting Fizeau interferometers is used to simultaneously measure the single-sided distance maps between each side of the wafer and the corresponding reference flat, with the thickness variation and shape being calculated from these data. Provisions are made to determine and eliminate the shape and tilt of the reference surfaces, and also to facilitate the correct overlay of the two single-sided measurements for the calculation of thickness variation and shape.

Abstract: A device is disclosed for supporting semiconductor wafers or other polished, opaque plates for processing or metrology in a vertical orientation, where the wafer loading and unloading occurs in a horizontal orientation. The device consists of a pallet designed with an opening such that both sides of the wafer are exposed. The wafer is loaded into the pallet to rest on three fixed rest members extending a short distance into the opening. Moving clamp members on the frame are located for movement toward or away from the corresponding rest members. Two cylindrical rest pins are located on axes parallel to the central axis of the opening to permit the wafer to rest under the force of gravity on the rest pins when the frame is rotated to its vertical position. Special provisions are made to minimize the effects of mechanical vibration of the wafer while insuring a robust physical restraint of the wafer within the apparatus without inducing mechanical stresses which could influence the shape of the wafer.

Abstract: A device is disclosed for supporting semiconductor wafers or other polished, opaque plates for processing or metrology in a vertical orientation, where the wafer loading and unloading occurs in a horizontal orientation. The device consists of a pallet designed with an opening such that both sides of the wafer are exposed. The wafer is loaded into the pallet to rest on three fixed rest members extending a short distance into the opening. Moving clamp members on the frame are located for movement toward or away from the corresponding rest members. Two cylindrical rest pins are located on axes parallel to the central axis of the opening to permit the wafer to rest under the force of gravity on the rest pins when the frame is rotated to its vertical position. Special provisions are made to minimize the effects of mechanical vibration of the wafer while insuring a robust physical restraint of the wafer within the apparatus without inducing mechanical stresses which could influence the shape of the wafer.

Abstract: The present invention consists of a technique and device for measuring the thickness variation and shape of wafers or other polished opaque plates. A combination of two improved phase-shifting Fizeau interferometers is used to simultaneously measure the single-sided distance maps between each side of the wafer and the corresponding reference flat, with the thickness variation and shape being calculated from these data. Provisions are made to determine and eliminate the shape and tilt of the reference surfaces, and also to facilitate the correct overlay of the two single-sided measurements for the calculation of thickness variation and shape.

Abstract: The absolute interferometric measurement of the shape of either flat, or spherical surfaces is achieved by incorporating a Fizeau-interferometer and a test piece holder capable of several degrees of freedom of movement relative to the reference position in the interferometer. A data acquisition and processing technique inter-compares three test parts in various combinations. Full surface absolute maps for each of the test pieces are determined using at least two different rotational positions of one test-piece to yield rotationally sheared maps of that surface. An optimized numerical reconstruction algorithm employing linear filtering and superposition of different angular shear spectra in the angular frequency domain is employed. The method does not require any assumptions about the surfaces under test; and it has low error propagation, even in the case of high spatial resolution.

Abstract: A low coherent noise interferometer system incorporates an improved low spatial coherence source obtained from a laser light source which supplies a beam of light through a beam-shaping lens to the first one of a set of two cascaded diffusers. One of the diffusers is dynamically changing, provided by a rotating ground glass disk. The diffusers then supply light to an interferometer of a two-beam interferometer configuration, such as Fizeau, Twyman-Green or Mach-Zehnder. In one embodiment, the first diffuser is the rotating ground glass diffuser and the second diffuser is a multi-mode optical fiber. The exit face of the fiber represents the spatially incoherent extended light source for the interferometer. The laser, the motor for driving the first diffuser and the diffusers themselves all are mounted on a separate base from the base on which the interferometer is mounted.

Abstract: The invention relates to an evaluation method for interferograms and an interferometer corresponding thereto with which tile influence of coherent noise is reduced with simultaneously high interference contrast. Several phase maps are computed from interferograms which are recorded with coherent light. The interferogram components of the test object and the interferogram components of the coherent noise are displaced relative to each other in the camera plane between recording the interferograms. The influence of the coherent noise is suppressed by subsequently averaging the phase maps.

Abstract: Described are a method and apparatus for the optical testing of samples in which a camera records a plurality of images of an interferogram or a bar pattern. Phase values are determined for each image point of each camera record, and then differences between the phase values of adjacent points in each image line and column are computed in modulo 2.pi.. These differences for each image point are summed over the plurality of camera images. After a number of images sufficient to assure desired accuracy have been summed, a single discontinuity elimination is carried out. This permits the rapid averaging of measurements over the plurality of camera images in real video time and remarkably reduces the measuring time and statistical errors.

Abstract: The optical testing method of the invention permits the reliable elimination of discontinuities, i.e., the determination of the integer values of modulo 2.pi. phase differences, even when the measured data includes seriously noisy signals. The intensity signals from a two-dimensional raster of camera image points are used to compute differences in phase values between adjacent image points in lines, as well as between adjacent image points in columns. The phase differences are summed along a closed path around each of a plurality of partial fields which are delineated by a predetermined set of adjacent image points. A filter (21) searches the vector field of these phase differences; and those partial fields where vortexes exist, i.e., each field for which the sign-correct sum along its closed path is not zero, are masked, thereby creating holes in the image pattern.

Abstract: The injection current for a laser diode is modulated so that a pregiven coherence function is obtained which drops off continuously at both ends outside of the coherence length. Several laser diodes are used for a very short coherence length for which the modulated wave numbers of the emitted radiation follow one another or overlap.