Patents by Inventor Klaus Goeschl

Klaus Goeschl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming a silicon-insulator layer and semiconductor device having the same
    Patent number: 11195713
    Abstract: In one aspect, a method of forming a silicon-insulator layer is provided. The method includes arranging a silicon structure in a plasma etch process chamber and applying a plasma to the silicon structure in the plasma etch process chamber at a temperature of the silicon structure equal to or below 100° C. The plasma includes a component and a halogen derivate, thereby forming the silicon-insulator layer. The silicon-insulator layer includes silicon and the component. In another aspect, a semiconductor device is provided having a silicon-insulator layer formed by the method.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: December 7, 2021
    Assignee: Infineon Technologies AG
    Inventors: Joachim Hirschler, Georg Ehrentraut, Christoffer Erbert, Klaus Goeschl, Markus Heinrici, Michael Hutzler, Wolfgang Koell, Stefan Krivec, Ingmar Neumann, Mathias Plappert, Michael Roesner, Olaf Storbeck
  • Methods of Forming a Silicon-Insulator Layer and Semiconductor Device Having the Same
    Publication number: 20190385842
    Abstract: In one aspect, a method of forming a silicon-insulator layer is provided. The method includes arranging a silicon structure in a plasma etch process chamber and applying a plasma to the silicon structure in the plasma etch process chamber at a temperature of the silicon structure equal to or below 100° C. The plasma includes a component and a halogen derivate, thereby forming the silicon-insulator layer. The silicon-insulator layer includes silicon and the component. In another aspect, a semiconductor device is provided having a silicon-insulator layer formed by the method.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 19, 2019
    Inventors: Joachim Hirschler, Georg Ehrentraut, Christoffer Erbert, Klaus Goeschl, Markus Heinrici, Michael Hutzler, Wolfgang Koell, Stefan Krivec, Ingmar Neumann, Mathias Plappert, Michael Roesner, Olaf Storbeck