Abstract: An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure.

Abstract: The invention relates to a reaction chamber system (10, 70) for processing samples, comprising a reaction chamber (12), a sample carrier (26) arranged at least in the reaction chamber (12). When in operation, said sample carrier can be displaced in relation to the reaction chamber (12) by means of a drive device (30) which is coupled to the sample carrier (26). The reaction chamber system also comprises heating means (50) for warming the samples. The invention is characterized in that the heating means (50, 54) are arranged on the sample carrier (26) and can be displaced with the sample carrier (26) when in operation.

Abstract: An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure.

Abstract: An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.

Abstract: A drive unit for a motor vehicle, comprising an engine, a transmission or gearbox, a clutch aggregate for transmitting torque, the clutch aggregate including at least two friction clutches that are assigned to an input shaft of the transmission or gearbox, wherein at least one of the at least two friction clutches features an energy accumulator operatively arranged to generate a lock-up force required for torque transmission through the clutch aggregate, and a control unit operatively arranged to control an automatic activation of the at least two friction clutches and the transmission or gearbox, wherein in the event of a malfunction of the activation of the friction clutch, the stored energy in the accumulator creates an interruption of torque transmission within a section of the drive unit connected downstream of the clutch aggregate.

Abstract: A method for producing a polymer structure on a patterning region of a substrate surface includes the steps of depositing an adhesion layer having a first polymer material onto the substrate surface, patterning the adhesion layer such that the first polymer material of the adhesion layer is removed in a first region and the first polymer material of the adhesion layer remains in a second region including the patterning region, depositing a polymer layer of a second polymer material onto the substrate surface and the adhesion layer and patterning the polymer layer such that the polymer structure forms in the second region.

Abstract: A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.

Abstract: A device with contact elements. One embodiment provides an electrical device including a structure defining a main face. The structure includes an array of cavities and an array of overhang regions, each overhang region defining an opening to one of the cavities. The electrical device further includes an array of contact elements, each contact element only partially filling one of the cavities and protruding from the structure over the main face.

Abstract: A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate.

Abstract: Field devices for measuring a pressure or a fill level are connected, by way of a cable connection or a radio connection, to stationary evaluation- and display devices. A parameterization- and data recording system for a field device is stated, which system may make it possible to maintain fast and flexible communication between field devices and a mobile control device. The system comprises a connection box and an interface adapter, which converts a HART signal or an I2C signal to a USB signal.

Abstract: An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.

Abstract: A method for obtaining an extract containing the natural mixture of conjugated equine estrogens by liquid-liquid extraction of the mixture of conjugated equine estrogens, wherein the mixture obtained is depleted in non-conjugated lipophilic compounds selected from the group consisting of non-conjugated flavonoids, non-conjugated isoflavonoids, non-conjugated norisoprenoids, non-conjugated steroids, in particular androstane and pregnane steroids, and comparable non-conjugated compounds.

Abstract: An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure.

Abstract: A device comprises a first means for separating a conductive layer from a semiconductor substrate and a second means for reducing a voltage dependent capacitive coupling between the conductive layer and the semiconductor substrate.

Abstract: Field devices for measuring a pressure or a fill level are connected, by way of a cable connection or a radio connection, to stationary evaluation- and display devices. To provide flexible parameterization or flexible measured-value inquiry, a connection box for the wireless transmission of signals between the field device and the control device is stated, which connection box comprises an interface connection and a radio interface. For the purpose of transmitting the signals, the interface connection and the radio interface are coupled to each other so as to be able to communicate.

Abstract: Field devices for measuring a pressure or a fill level are connected, by way of a cable connection or a radio connection, to stationary evaluation- and display devices. To provide flexible parameterisation or flexible measured-value inquiry, a connection box for the wireless transmission of signals between the field device and the control device is stated, which connection box comprises an interface connection and a radio interface. For the purpose of transmitting the signals, the interface connection and the radio interface are coupled to each other so as to be able to communicate.