Patents by Inventor Klaus Hemmert

Klaus Hemmert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7416420
    Abstract: Conductive adhesive bonds are used preferably where the contact bonds are subject to great temperature variations, for example, on a throttle valve controller. In order to increase the mechanical stabilization of the conductive adhesive bonds, the surface of the contacts are machined and provided with structures such as ribbing, prickles, etc. As a result of this structuring, the conductive adhesive interlocks mechanically at these points. This leads to a high contact reliability also at extreme temperature changes.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: August 26, 2008
    Assignee: Preh-Werke GmbH & Co. KG
    Inventors: Hans-Michael Schmitt, Oswald Reuss, Annegret Suckfuell, Klaus Hemmert
  • Patent number: 7146723
    Abstract: The mechanical connection of contacts through induction soldering is improved. To which end, a plastic dome is produced through preliminary encapsulation by injection molding of at least one contact and subsequent final encapsulation, where the two contact geometries to be joined can, for example, be premated. With an appropriate solder preform, the plug-in connection can be secured through induction soldering by enclosing this dome. The appropriate tool is then placed over the plastic dome, by which the heat generated melts the solder preform and securely joins the two contacts to one another.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: December 12, 2006
    Assignee: Preh-Werke GmbH & Co. KG
    Inventors: Hans-Michael Schmitt, Klaus Hemmert, Bernhard Knuettel, Oswald Reuss, Annegret Suckfuell
  • Publication number: 20040003936
    Abstract: The mechanical connection of contacts through induction soldering is improved. To which end, a plastic dome is produced through preliminary encapsulation by injection molding of at least one contact and subsequent final encapsulation, where the two contact geometries to be joined can, for example, be premated. With an appropriate solder preform, the plug-in connection can be secured through induction soldering by enclosing this dome. The appropriate tool is then placed over the plastic dome, by which the heat generated melts the solder preform and securely joins the two contacts to one another.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 8, 2004
    Inventors: Hans-Michael Schmitt, Klaus Hemmert, Bernhard Knuettel, Oswald Reuss, Annegret Suckfuell
  • Publication number: 20030216080
    Abstract: Conductive adhesive bonds are used preferably where the contact bonds are subject to great temperature variations, for example, on a throttle valve controller. In order to increase the mechanical stabilization of the conductive adhesive bonds, the surface of the contacts are machined and provided with structures such as ribbing, prickles, etc. As a result of this structuring, the conductive adhesive interlocks mechanically at these points. This leads to a high contact reliability also at extreme temperature changes.
    Type: Application
    Filed: May 16, 2003
    Publication date: November 20, 2003
    Inventors: Hans-Michael Schmitt, Oswald Reuss, Annegret Suckfuell, Klaus Hemmert