Abstract: In a replacement gate approach, the sacrificial gate material is exposed on the basis of enhanced process uniformity, for instance during a wet chemical etch step or a CMP process, by forming a modified portion in the interlayer dielectric material by ion implantation. Consequently, the damaged portion may be removed with an increased removal rate while avoiding the creation of polymer contaminants when applying an etch process or avoiding over-polish time when applying a CMP process.

Abstract: In a replacement gate approach in sophisticated semiconductor devices, a tantalum nitride etch stop material may be efficiently removed on the basis of a wet chemical etch recipe using ammonium hydroxide. Consequently, a further work function adjusting material may be formed with superior uniformity, while the efficiency of the subsequent adjusting of the work function may also be increased. Thus, superior uniformity, i.e., less pronounced transistor variability, may be accomplished on the basis of a replacement gate approach in which the work function of the gate electrodes of P-channel transistors and N-channel transistors is adjusted after completing the basic transistor configuration.

Abstract: During the formation of sophisticated gate electrode structures, a replacement gate approach may be applied in which plasma assisted etch processes may be avoided. To this end, one of the gate electrode structures may receive an intermediate etch stop liner, which may allow the replacement of the placeholder material and the adjustment of the work function in a later manufacturing stage. The intermediate etch stop liner may not negatively affect the gate patterning sequence.

Abstract: During a manufacturing sequence for forming a sophisticated high-k metal gate structure, a cover layer, such as a silicon layer, may be deposited on a metal cap layer in an in situ process in order to enhance integrity of the metal cap layer. The cover layer may provide superior integrity during the further processing, for instance in view of performing wet chemical cleaning processes and the subsequent deposition of a silicon gate material.

Abstract: By forming a non-oxidizable liner in isolation trenches, the creation of compressive stress may be significantly reduced, wherein, in illustrative embodiments, silicon nitride may be used as liner material. For this purpose, the etch behavior of the silicon nitride may be efficiently modified on the basis of an appropriate surface treatment, thereby providing a high degree of material integrity during a subsequent etch process for removing non-modified portions of silicon nitride, which may also be used as an efficient CMP stop layer.

Abstract: By modifying the dielectric liner for a spacer structure so as to exhibit an enhanced diffusion blocking characteristic, for instance by incorporating nitrogen, the out-diffusion of P-dopants, such as boron, into the dielectric material may be significantly reduced. Consequently, transistor performance, especially of P-type transistors, may be significantly enhanced while nevertheless a high degree of compatibility with conventional techniques may be maintained.

Abstract: By forming a non-oxidizable liner in isolation trenches, the creation of compressive stress may be significantly reduced, wherein, in illustrative embodiments, silicon nitride may be used as liner material. For this purpose, the etch behavior of the silicon nitride may be efficiently modified on the basis of an appropriate surface treatment, thereby providing a high degree of material integrity during a subsequent etch process for removing non-modified portions of silicon nitride, which may also be used as an efficient CMP stop layer.

Abstract: By locally heating isolation trenches with different annealing conditions, a different magnitude of intrinsic stress may be obtained in different isolation trenches. In some illustrative embodiments, the different anneal temperature may be achieved on the basis of an appropriate mask layer, which may provide a patterned optical response for a lamp-based or laser-based anneal process. Consequently, the intrinsic stress of isolation trenches may be specifically adapted to the requirements of circuit elements, such as N-channel transistors and P-channel transistors.

Abstract: A static mixing device (1), containing at least one first mixing element (A) which contains a plurality of particularly parallel channels (2), which are orthogonal in relation to the main direction of flow (H), on a front side, wherein the channels (2) are not connected to each other but comprise through-flow openings (3) in the main direction of flow (H); further comprising a second mixing element (B) which enters into contact with the first mixing element (A) and which comprises a plurality of particularly parallel channels (2), which are orthogonal in relation to the main direction of flow (H), wherein the channels (2) are interconnected, wherein openings are more particularly provided in the side walls of the channels (2), enabling a medium (M) to pass therethrough in the main direction of flow (H). A plurality of more particularly parallel channels (2), which are not connected to each other, are arranged in an orthogonal manner in relation to the main direction of flow (H) on a rear side (R) thereof.