Abstract: A monolithically integrated semiconductor assembly having a power component, and a method for manufacturing a semiconductor assembly, are proposed, a monolithically integrated resistor element being provided between a first terminal and the second region, and a comparatively low-impedance electrical connection through the first region being provided between the resistor element and the second region.

Abstract: A monolithically integrated semiconductor assembly having a power component, and a method for manufacturing a semiconductor assembly, are proposed, a monolithically integrated resistor element being provided between a first terminal and the second region, and a comparatively low-impedance electrical connection through the first region being provided between the resistor element and the second region.

Abstract: A circuit arrangement for ignition systems for detecting an arc voltage at a spark plug has an ignition coil having a primary side on which the arc voltage is transformed and also having a primary winding, an ignition switch located in series with the primary winding of the ignition coil, a pnp transistor working as a voltage converter and having a control stage so that the arc voltage transformed on the primary side activates the control stage. The transistor is connected on an emitter side to a connection between the primary winding and the ignition switch. The pnp transistor is connected on a base side to a battery voltage. A resistor is assigned as an emitter follower to the pnp transistor. A measuring element is formed as a resistor. The transistor with its collector connection feeds to the measuring element a collector current which is proportional to the arc voltage.

Abstract: An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO.sub.2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO.sub.2 in pre-hardening storage of the resin.

Abstract: A transistor arrangement, particularly for the fast switching of inductive loads, includes a driving first transistor and a power output second transistor (T1, T2) interconnected as a Darlington pair having a base terminal, an emitter terminal and a collector terminal. A third transistor (T3) has its collector connected to the base of the first transistor (T1) and its emitter connected to the emitter terminal (E). A fourth transistor (T4) of a conductivity type opposite to that of the first, second and third transistors has its base connected to the collector terminal, its emitter connected to the base terminal, and its collector connected to the base of the third transistor (T3). This structure is particularly suited for a monolithic integration.

Abstract: A semiconductor rectifier which is embodied substantially in a rotationally symmetrical manner is proposed. The semiconductor rectifier includes a semiconductor chip (10) and two connector leads (11, 12), each of which is soldered to one of the two main surfaces of the semiconductor chip (10). The first lead (11) forms a bolt-like, solid metal base, which comprises a first part (11a) soldered to the semiconductor chip (10) and a second part (11b) provided with knurling. The second lead (12) is embodied as a head wire and the head portion (12a) of this head wire is soldered to the semiconductor chip (10). A synthetic resin mass (13) is furthermore provided, which covers the rim of the semiconductor chip (10), the first part (11a) of the first lead (11) and portions of the second lead (12). The second part (11b) of the first lead (11) is pressed into a cooling plate (14) serving to cool the rectifier.

Abstract: To prevent malfunction due to misfire of a distributorless internal combustion engine (ICE), in which two spark plugs (20, 21; 27, 28) are connected to the same output terminals of the secondary (9) of an ignition coil through respectively reversely polarized diodes (18, 19; 25, 26), the polarity of the output spark pulse at the terminals (17, 24) of the ignition coil determining the identity of the spark plugs which have spark discharges occur thereacross due to the polarization of the serially connected diodes, additional diodes (22, 23; 29, 30) of the high-voltage type are connected in parallel across each of the spark plugs (20, 21; 27, 28) and polarized in reverse polarity with respect to the serially connected diodes, connected to the respective spark plugs, to thereby short-circuit current through the additional diode upon passage of energy by a serially connected diode in reverse direction due to malfunctioning, for example alloying-through or at least partial short-circuiting of the respective serial

Abstract: To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two plate-like, series-connected semiconductor diodes are soldered to a common tap electrode between them. An external lead wire is soldered to each of the remaining sides of the diodes. The entire soldered structure is embedded in a single mass of resin or plastic, the ends of the electrodes being configured to serve as anchoring elements in the plastic mass.

Abstract: To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two semiconductor diodes in the shape of small plates or discs are disposed to hold between them a center electrode. A wire-like lead electrode is held in contact with the remaining side of one diode and the second lead electrode is cup-shaped and its walls surround the diode stack. An inwardly extending lip of the cup-shaped electrode supports a spring which exerts pressure on the enlarged tip of the first lead electrode, thus clamping the entire stack in contact. A cover plate seals the opening of the cup and a resinous mass may be applied over the cover plate to provide a hermetic seal.