Patents by Inventor Klaus Jürgen REINGRUBER

Klaus Jürgen REINGRUBER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having a variable redistribution layer thickness
    Patent number: 10553538
    Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Klaus Jürgen Reingruber, Sven Albers, Christian Georg Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner, Marc Dittes
  • SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS
    Publication number: 20190043800
    Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.
    Type: Application
    Filed: October 4, 2018
    Publication date: February 7, 2019
    Inventors: Klaus Jürgen REINGRUBER, Sven ALBERS, Christian Georg GEISSLER, Georg SEIDEMANN, Bernd WAIDHAS, Thomas WAGNER, Marc DITTES
  • Semiconductor package having a variable redistribution layer thickness
    Patent number: 10115668
    Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: October 30, 2018
    Assignee: Intel IP Corporation
    Inventors: Klaus Jürgen Reingruber, Sven Albers, Christian Georg Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner, Marc Dittes
  • SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS
    Publication number: 20170170111
    Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Klaus Jürgen REINGRUBER, Sven Albers, Christian Georg Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner, Marc Dittes