Abstract: Methods are described for constructing a mechanical resonating structure by applying an active layer on a surface of a compensating structure. The compensating structure comprises one or more materials having an adaptive resistance to deform that reduces a variance in a resonating frequency of the mechanical resonating structure, wherein at least the active layer and the compensating structure form a mechanical resonating structure having a plurality of layers of materials A thickness of each of the plurality of layers of materials results in a plurality of thickness ratios therebetween.

Abstract: Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.

Abstract: Circuits for charging capacitors in connection with oscillators are described. The oscillator may include a mechanical resonator. The circuits may include a charging element and a switched capacitor subcircuit to control operation of the charging element, and may be considered a charging circuit in some scenarios. The charging circuits may provide rapid charging of a capacitor to provide a reference voltage to the oscillator.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Abstract: Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Abstract: A variable phase amplifier circuit is disclosed and its method of use in tuning devices having resonators. The variable phase amplifier receives an input differential signal pair. The input differential signal pair can be generated by a resonator device. The variable phase amplifier generates a modified differential signal pair in response to receiving the input differential signal pair. The variable phase amplifier provides a means to vary the phase of the modified differential signal pair with respect to the input differential signal pair, in an accurate and stable manner. If the modified differential signal pair with a phase shift introduced in it is fed back to the resonator device, the resonator will change its frequency of oscillation, where the new frequency of oscillation is a function of the phase of the modified differential signal pair.

Abstract: Aspects of the subject disclosure include, for example, constructing a mechanical resonating structure by applying an active layer on a surface of a compensating structure, wherein the compensating structure comprises one or more materials having an adaptive resistance to deform that reduces a variance in a resonating frequency of the mechanical resonating structure, wherein at least the active layer and the compensating structure form a mechanical resonating structure having a plurality of layers of materials, and wherein a thickness of each of the plurality of layers of materials results in a plurality of thickness ratios therebetween. Other embodiments are disclosed.

Abstract: Frequency synthesizers for use with oscillators that generate an arbitrary frequency are described, as well as related devices and methods. Divider information can be generated or otherwise accessed for use in configuring a phase lock loop device that is adapted for coupling with the oscillator, where the phase lock loop device can include a plurality of integer dividers without utilizing a fractional divider, where the divider information can include frequency deviations corresponding to groups of integer divider settings for the phase lock loop device, and where each deviation of the frequency deviations can be based on a frequency differential between a standard operating frequency and an output frequency for the phase lock loop utilizing one group of integer divider settings from the groups of integer divider settings.

Abstract: The disclosed power-on reset circuit provides an indication of when and whether a supply voltage Vdd has reached a trigger voltage level Vtrig. The disclosed circuit includes a flip-flop circuit and a first comparator circuit. The circuit according to the invention has a D input node of the flip-flop circuit coupled to the supply voltage. The first comparator circuit outputs a clock signal, where the flip-flop circuit is clocked by the clock signal. A Q output node of the flip-flop circuit provides the power-on reset signal, where the power-on reset signal is in a LO state when the supply voltage is at a voltage level that is less than the trigger voltage level Vtrig. The power-on reset signal is in a HI state when the supply voltage is at a voltage level that is greater than the trigger voltage level Vtrig.

Abstract: Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Abstract: Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Aspects of the subject disclosure include, for example, obtaining a mechanical resonating structure comprising a compensating structure, where the compensating structure comprises one or more materials having an adaptive stiffness that reduces a variance in a resonating frequency of the mechanical resonating structure (f0), and adjusting at least one of a value of f0 of the obtained mechanical resonating structure or a value of a temperature for which temperature coefficient of frequency of the obtained mechanical resonating structure is approximately zero (T0) by altering a thickness of at least one targetable material of the mechanical resonating structure. Other embodiments are disclosed.

Abstract: Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.

Abstract: Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Abstract: Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.

Abstract: Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.