Abstract: A feedthrough for feeding a microwave signal through a wall of a casing comprises a signal waveguide having at least two portions having different cross-sections. The portion having the smaller cross-section is filled with plastically-deformable dielectric material which, under the action of pressure and heat, is bonded to the walls of the portion in which it is located. The dimensions of the portion are such as to provide an impedance match with the adjacent portions. An antenna couples electromagnetic energy between the waveguide and a strip transmission line. A metal cap seals the end of the waveguide and screens the antenna.

Abstract: A feedthrough for feeding a microwave signal through a wall of a casing comprises a signal waveguide having at least two portions having different cross-sections. The portion having the smaller cross-section is filled with plastically-deformable dielectric material which, under the action of pressure and heat, is bonded to the walls of the portion in which it is located. The dimensions of the portion are such as to provide an impedance match with the adjacent portions. An antenna couples electromagnetic energy between the waveguide and a strip transmission line. A metal cap seals the end of the waveguide and screens the antenna.

Abstract: An adhesive-dispensing method applies a pattern of adhesive onto a circuit-board carrier such that any discontinuities in the pattern, i.e. starting-points, end-points or turning-points, are outside a footprint of a pair of substrates or MMICs intended to be attached, adjacent each other and spaced apart, to the circuit-board, and in particular outside such footprint in the area of transition between one substrate/MMIC and the other. The adhesive is preferably applied in straight lines and in a direction substantially transverse to the direction of transition between the two substrates/MMICs.

Abstract: On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g.

Abstract: On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g.

Abstract: An adhesive-dispensing method applies a pattern of adhesive onto a circuit-board carrier such that any discontinuities in the pattern, i.e. starting-points, end-points or turning-points, are outside a footprints of a pair of substrates or MMICs intended to be attached, adjacent each other and spaced apart, to the circuit-board, and in particular outside such footprint in the area of transition between one substrate/MMIC and the other. The adhesive is preferably applied in straight lines and in a direction substantially transverse to the direction of transition between the two substrates/MMICs.

Abstract: A method of creating an access to a waveguide arrangement in order to couple measuring signals into and/or out of the waveguide arrangement includes providing a cover for covering an opening in a waveguide wall of the waveguide arrangement at a location suitable as a measuring signal access, removing the cover, and replacing the cover with another cover equipped with a coupling device.

Abstract: Circuit device including: a waveguide for transmitting electromagnetic waves with an electric field extending in a selected direction; a diode mounted in the waveguide; a coaxial line connected for supplying a DC voltage to the diode; and a planar line for supplying at least one high frequency signal, the planar line extending perpendicular to the direction of the electric field and projecting into the waveguide, and the line being disposed at a distance from the diode for establishing a capacitive coupling with the diode.