Patents by Inventor Klaus-Jurgen Steffner

Klaus-Jurgen Steffner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8476377
    Abstract: The invention relates to crosslinkable, thermoplastic polyamide molding compounds. The polyamides are selected from a group comprising amorphous or microcrystalline polyamides, copolyamides thereof and blends thereof, as well as blends of such polyamides with semicrystalline polyamides. A polyamide molding compound according to the invention is characterized in that it comprises a crosslinking additive which causes the production of crosslinked molded parts formed from said polyamide molding compound under the effect of high-energy irradiation, having a Tg value of >140° C. and a minimum dimensional stability of 90% at temperatures of ?180° C. These polyamides have a substantially linear structure and the monomers thereof have no olefin C?C double bonds. Corresponding crosslinked polyamide molded parts produced from a polyamide molding compound and the use of this polyamide molding compound to produce these crosslinked polyamide molded parts are additionally disclosed.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: July 2, 2013
    Assignee: EMS—Patent AG
    Inventor: Klaus-Jürgen Steffner
  • Publication number: 20090171038
    Abstract: The invention relates to crosslinkable, thermoplastic polyamide molding compounds. The polyamides are selected from a group comprising amorphous or microcrystalline polyamides, copolyamides thereof and blends thereof, as well as blends of such polyamides with semicrystalline polyamides. A polyamide molding compound according to the invention is characterized in that it comprises a crosslinking additive which causes the production of crosslinked molded parts formed from said polyamide molding compound under the effect of high-energy irradiation, having a Tg value of >140° C. and a minimum dimensional stability of 90% at temperatures of ?180° C. These polyamides have a substantially linear structure and the monomers thereof have no olefin C?C double bonds. Corresponding crosslinked polyamide molded parts produced from a polyamide molding compound and the use of this polyamide molding compound to produce these crosslinked polyamide molded parts are additionally disclosed.
    Type: Application
    Filed: December 15, 2006
    Publication date: July 2, 2009
    Applicant: EMS-PATENT AG
    Inventor: Klaus-Jurgen Steffner