Abstract: Tool for drilling bore holes and earth formations in which a bit body matrix, including tungsten carbide, has a plurality of carriers secured thereto, to each of which a cutting element is secured by soldering, after the body matrix has been produced, to avoid subjecting the diamond material embodied in the cutting element to the high temperatures required to produce the matrix body, which would have deleterious effects on the diamond. Each carrier has great rigidity and is provided with a plane surface confronted by the plane back surface of the cutting element to provide a desired narrow solder gap between the cutting element and carrier of uniform width, into which the solder is deposited to adhere the cutting element and carrier together, with the load being transmitted directly from the cutter element to the rigid carrier.