Patents by Inventor Klaus Keiner

Klaus Keiner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating an integrated semiconductor circuit
    Patent number: 6868530
    Abstract: A method for fabricating a semiconductor circuit uses a computer program to compute a circuit diagram that is made up of a large number of surface cells, each having a uniform height. Space-saving layouts require a uniform cell height for all the surface cells. The height is conventionally prescribed by a computer file containing standardized dimensions for a large number of surface cells. Accordingly, such surface cells as are required for a specific semiconductor circuit that is to be fabricated are selected, and the selection is used to compute a circuit-specific uniform cell height. The height is less than the height prescribed by the computer file and results in surface area being saved on the semiconductor chip.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: March 15, 2005
    Assignee: Infineon Technologies AG
    Inventors: Michael Wagner, Klaus Keiner
  • Method for fabricating an integrated semiconductor circuit
    Publication number: 20030106026
    Abstract: A method for fabricating a semiconductor circuit uses a computer program to compute a circuit diagram that is made up of a large number of surface cells, each having a uniform height. Space-saving layouts require a uniform cell height for all the surface cells. The height is conventionally prescribed by a computer file containing standardized dimensions for a large number of surface cells. Accordingly, such surface cells as are required for a specific semiconductor circuit that is to be fabricated are selected, and the selection is used to compute a circuit-specific uniform cell height. The height is less than the height prescribed by the computer file and results in surface area being saved on the semiconductor chip.
    Type: Application
    Filed: December 5, 2002
    Publication date: June 5, 2003
    Inventors: Michael Wagner, Klaus Keiner