Patents by Inventor Klaus Lönne

Klaus Lönne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and a method for observing and predicting a physiological state of an animal
    Patent number: 7676346
    Abstract: A system for observing and predicting a physiological state of an animal has been provided.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: March 9, 2010
    Assignees: Lattec I/S, University of Aarhus
    Inventors: Nic C. Friggens, Klaus Lønne Ingvartsen, Inge Riis Korsgaard, Torben Larsen, Peter Løvendahl, Carsten Ridder, Nicolai Ingemann Nielsen
  • System and a method for observing and predicting a physiological state of an animal
    Patent number: 7302349
    Abstract: A system for observing and predicting a physiological state of an animal has been provided.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: November 27, 2007
    Assignees: Lattec I/S, University of Aarhus
    Inventors: Nic C. Friggens, Klaus Lønne Ingvartsen, Inge Riis Korsgaard, Torben Larsen, Peter Løvendahl, Carsten Ridder, Nicolai Ingemann Nielsen
  • Soldering paste for producing geometrical metal structures with precise contours
    Patent number: 6207300
    Abstract: A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 &mgr;m, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: March 27, 2001
    Assignees: Federal-Mogul Sealing Systems GmbH, Degussa-Hüls Aktiengesellschaft
    Inventors: Jürgen Koch, Manfred Koschlig, Harald Krappitz, Wolfgang Weber, Klaus Lönne, Klaus Schmitt
  • Method of providing a wear-resistant overlay on a metal sealing gasket
    Patent number: 6180167
    Abstract: A flat metal sealing gasket is made as follows: on an unhardened spring steel plate having an aperture and a bead surrounding the aperture, a sinterable powder is deposited along the bead in a desired shape and thickness. Thereafter a sufficiently high temperature is applied to the deposited sinterable powder to effect sintering or melting of the powder to provide a pressure-resistant overlay on the plate and to simultaneously effect a hardening of the plate.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: January 30, 2001
    Assignee: Goetze Payen GmbH
    Inventors: Klaus-Peter Majewski, Klaus Schmitt, Markus Heilig, Matthias Heike, Klaus Lönne