Abstract: A scintillator-photosensor sandwich is generated by gluing a first support frame onto an adhesive layer (covered with a protective film on the side facing the adhesive layer, the first frame having a size that (in terms of area) surrounds the scintillator-photosensor sandwich to be produced. The first support frame is placed onto a flat base that supports a first function layer (either a scintillator layer or a photosensor layer). The adhesive layer supported on the first support frame and the first function layer are laminarly assembled. The protective film is removed from the adhesive layer and a second function layer (the other of the scintillator layer or the photosensor layer not used as the first function layer) is assembled with the first function layer with the interposed adhesive layer.

Abstract: In a method to produce a scintillator-photosensor sandwich, as well as a scintillator-photosensor sandwich and a radiation detector with such a scintillator-photosensor sandwich, the scintillator-photosensor sandwich is generated by gluing a first support frame onto an adhesive layer (covered on at least one side with a second protective film on the side facing the adhesive layer, the first frame having a size that (in terms of area) surrounds the scintillator-photosensor sandwich to be produced. The first support frame is placed onto a flat base that supports a first function layer (either a scintillator layer or a photosensor layer). The adhesive layer supported on the first support frame and the first function layer are laminarly assembled. The second protective film is removed from the adhesive layer and a second function layer (the other of the scintillator layer or the photosensor layer not used as the first function layer) is assembled with the first function layer with the interposed adhesive layer.

Abstract: In a method to produce a scintillator-photosensor sandwich for use in a pixel-resolving radiation detector for ionizing radiation, either a scintillator layer or a photosensor layer can respectively be the first and second function layers (alternatively). A transfer adhesive tape carries an adhesive layer having an exposed first side and a second side covered by protective film. The exposed side of the adhesive layer is applied onto a first of the function layers. A first lamination of the adhesive layer including the protective film onto the first function layer is implemented. The protective film is removed. A second of the function layers is then placed in contact with the second side of the adhesive layer that is situated on the first of the function layers. A second lamination of the two function layers with the adhesive layer situated between them is implemented.

Abstract: A scintillator layer is applied onto a photosensor layer to produce an x-ray detector or an x-ray detector element for imaging detection of ionizing radiation. The production process is improved by, in the production of the scintillator layer, an adhesive layer with a protective layer is applied onto the scintillator layer. This can occur layer by layer or a transfer adhesive tape that already includes the protective layer as a protective film can also be used.

Abstract: A scintillator plate has a radiation-permeable substrate on which a scintillator layer is applied. The substrate is composed of a cellular metallic material and has a smooth, closed outer skin. Such a scintillator plate has high mechanical stability with good radiation permeability.

Abstract: The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the latter is patterned, then the first is seeded and lastly metallized.

Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k?2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for micro-electronics.

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.

Abstract: The present invention provides a process for wiring electrical contact sites, in particular on the surface of an electronic or microelectronic component, with the following steps: applying and patterning at least one dielectric on the component surface; currentlessly depositing a conductor starting layer for producing metal wiring interconnects and substitute contact sites with short-circuit contacts for interconnecting the individual metal wiring interconnects and the corresponding electrical contact sites; reinforcing the conductor starting layer by a common electrodepositing process; and separating the short-circuit contacts for separating the electrical contact sites or the contact sites of the wiring from one another.

Abstract: The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an electrically conductive layer by metallization.

Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Abstract: Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.

Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.

Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for microelectronics.

Abstract: Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an electrically conductive layer by metallization.

Abstract: A method for metallizing dielectrics includes applying a photosensitive dielectric to a substrate. The dielectric is then exposed to light through a mask, is seeded with a metal and is subjected to a temperature treatment. Afterwards, the dielectric is chemically metallized. Alternatively, the dielectric can be first be seeded with a metal after being applied to the substrate, and can then be exposed to light through a mask. Afterwards, excess seeding material is removed and the dielectric is chemically metallized.