Patents by Inventor Klaus Martinschitz

Klaus Martinschitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10163681
    Abstract: A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: December 25, 2018
    Assignee: EV Group E. Thallner GmbH
    Inventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan, Kurt Hingerl
  • Patent number: 9067363
    Abstract: A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material. The method including the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 ?m; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: June 30, 2015
    Assignee: EV Group E. Thallner GmbH
    Inventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan
  • Publication number: 20140196842
    Abstract: A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 ?m; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.
    Type: Application
    Filed: January 23, 2012
    Publication date: July 17, 2014
    Inventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan
  • Publication number: 20140154867
    Abstract: A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.
    Type: Application
    Filed: August 30, 2011
    Publication date: June 5, 2014
    Inventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan, Kurt Hingerl