Abstract: The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component (4) comprising contacts (6) oriented towards an insulating layer (1) which is fixed to a laminate consisting of a conductive layer (2) and a insulating layer (1). Once the component (4) has been fixed to the insulating layer (1), at least one hole or perforation (8, 11) corresponding to the contacts (6) of the component (4) are formed in the conducting layer (2) and in the insulating layer (1), the contacts come into contact with the conducting layer (2), enabling a reliable integration or embedding of an electronic component (4) into a printed circuit board.

Abstract: The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component (4) comprising contacts (6) oriented towards the insulating layer (1) is fixed to a laminate at least consisting of a conducting or conductive layer (2) and a non-conducting or insulating layer (1). According to the invention, once the component (4) has been fixed to the insulating layer (1), holes or perforations (8, 11) corresponding to the contacts (6) of the component (4) are formed in the conducting layer (2) and in the insulating layer (1), the contacts coming into contact with the conducting layer (2), enabling a reliable integration or embedding of an electronic component (4) into a printed circuit board.