Abstract: A cooling system (26) comprising a cooling arrangement (24, 24?, 24?) having a serpentine passageway (20) for a circulating fluid coolant is disclosed. The serpentine passageway (20) is provided between a plurality of walls (6, 8) displaced from each other. A series of baffles (10) each having a proximal portion (12) and a distal portion (14) are disposed within the passageway (20). The baffles (10) extend from one of the walls into the passageway (20). The distal portion (14) has a width (W2) that is larger than the width (W1) of the proximal portion (12).

Abstract: A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.

Abstract: The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.

Abstract: A flow distribution module (1) for distributing a flow of fluid over a surface to be cooled is disclosed. The flow distribution module (1) comprises a housing (2) and a cover plate (3). The housing (2) defines at least one flow cell (5), the flow cell(s) (5) being positioned in such a way that a flow of fluid flowing through a flow cell (5) from an inlet opening (6) to an outlet opening (7) is conveyed over the surface to be cooled, each flow cell (5) being formed to cause at least one change in the direction of flow of the fluid flowing through the flow cell (5). The cover plate (3) is arranged adjacent to the flow cell(s) (5) and defines the surface to be cooled. At least a part of the surface to be cooled defined by the cover plate (3) is provided with a surface pattern (8) of raised and depressed surface portions.

Abstract: A flow distributor for distributing a flow of fluid through a cooling body, the flow distributor comprising: an inlet manifold; an outlet manifold; and one or more flow cells, each being arranged to fluidly interconnect the inlet manifold and the outlet manifold, each flow cell comprising a cell inlet in fluid communication with the inlet manifold, a cell outlet in fluid communication with the outlet manifold, and a flow channel for guiding a flow of fluid from the cell inlet to the cell outlet, wherein the flow distributor is formed within a solid layer which is bonded directly to an insulating layer to be cooled.

Abstract: The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.

Abstract: The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f is arranged between at least two cells.

Abstract: A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel (50). The main channel is formed as a meandering sequence of channel segments (61,62,63,64). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel (71,72,73) which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel.

Abstract: The invention relates to the programming of a motor controller by means of a configuration file which is sent to the motor controller. The configuration file is typically sent from a PC, but with this invention it is now possible to generate and to download the file directly to the motor controller from an Internet server. The Internet server is provided by the manufacturer of the motor controller and contains an interactive programming software, a motor controller database, a compiler and a transmitter unit. The invention makes up-dating and maintenance of the motor controller software quicker and easier as known so far.

Abstract: A distributor (1) for distributing a flow of cooling fluid over surface(s) (3) to be cooled. Has a housing (13) manufactured in a single piece with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29). Makes it easier and more cost effective to manufacture the distributor (1). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9). May be adapted to cool two or more surfaces (3) simultaneously. Also a fluid-coolable unit comprising the distributor (1). Suitable for removing heat from an electronic circuit, such as integrated circuit or CPU.

Abstract: A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

Abstract: The invention relates to a cooling device comprising a heat-conducting cooling plate on the side of the electronic power components to be cooled and a platelike cooling fluid distributing device. The distributing device has cooling fluid outlets on the side facing the cooling plate, said outlets being arranged at a distance from and pointing towards the cooling plate. The distributing device also comprises at least one drain outlet for the cooling fluid. The invention aims at providing a cooling device which is suitable for different forms and number of power components and ensures even cooling throughout the entire cooling surface for different forms and number of power components while simplifying the production of said cooling device.

Abstract: The invention relates to the programming of a motor controller by means of a configuration file which is sent to the motor controller. The configuration file is typically sent from a PC, but with this invention it is now possible to generate and to download the file directly to the motor controller from an Internet server. The Internet server is provided by the manufacturer of the motor controller and contains an interactive programming software, a motor controller database, a compiler and a transmitter unit. The invention makes up-dating and maintenance of the motor controller software quicker and easier as known so far.