Abstract: A method and device for producing an adhesive-bonded join between a semiconductor wafer and a carrier plate, the semiconductor wafer being held at a distance above the carrier plate and being convexly deformed by an elastic wall of an inflatable pressure chamber, then being laid onto the carrier plate, enclosing an adhesive substance, and is joined in a nonpositively locking manner to the carrier plate. An edge region of the semiconductor wafer is sucked up and held above the carrier plate, the suction is ended and the semiconductor wafer is allowed to drop in a convexly deformed state onto the carrier plate, and only a central area of the semiconductor wafer is pressed onto the carrier plate by the elastic wall of the pressure chamber.

Abstract: A process and device for polishing semiconductor wafers has at least one side of at least one semiconductor wafer pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to polish the wafer. During the polishing, the semiconductor wafer passes over at least two regions on the polishing plate, which regions have defined radial widths and are at different temperatures. Temperature-control means are provided in the polishing plate, with the aid of which the number, the radial widths and the temperatures of the regions are fixed before the semiconductor wafers are polished.

Abstract: A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.

Abstract: The free transmission capacity of one or more paging channels within a radio cell is employed in order to transmit organization specifications concerning the paging channel frequencies employed in the neighboring radio cells. The appertaining mobile radio station carries out level comparison measurements at suitable chronological intervals on the specific paging channel frequencies for the purpose of its potentially necessary reassignment to a neighboring radio cell. A reassignment of the appertaining mobile radio station to the corresponding neighboring radio cell occurs when a better radio connection quality exists on one of the neighboring radio cell paging channels.