Abstract: The invention relates to a method for producing a housing body at least parts of a housing body, especially for encapsulating optoelectronic components. According to the inventive method, a housing element is joined to a preferably metallic housing structure, and the housing element and the housing structure are brought into contact by means of a glass solder. The aim of the invention is to enable a reliable, cost-effective and preferably hermetic join to be created between the metallic sleeve and the sheet of glass. To this end, the glass solder is applied as a mouldable mass, especially as a paste, before the housing element and housing structure are joined; the glass solder is pre-vitrified and fixed in its shape by means of at least one single energy input, especially by burning out organic constituents; and once the housing element has been inserted into the housing structure, an at least partially hermetic join is created between the sheet of glass and the housing structure by means of heating.