Abstract: After having been pretreated by kneading at its softening temperature, a cellulose acetate is subjected to block polymerization by being kneaded with, for example, an ethylene vinyl acetate copolymerizate, at its mean softening temperature. If necessary, the block copolymerizate may be subsequently cross-linked by adding a peroxide.

Abstract: Disclosed is a process for passivating a first metallization pattern on a semiconductor substrate and providing a substantially planar quartz surface for subsequent metallization patterns in which a first polymer layer is applied over a first metallization layer and other portions of the substrate, providing a substantially planar surface. After a first curing, the first layer of polymer material is removed down to a thin layer of defined thickness over the first metallization pattern and, after a second curing, a quartz layer is applied over the polymer layer forming a substantially planar quartz top surface. Also disclosed is a method of forming via holes to the first metallization pattern as well as particular photoresist resins.