Abstract: A cooling element for cooling of an electric device is provided. The cooling element includes a first plate having a first surface, a second plate having a first surface and a second surface opposite to the first surface, wherein the second surface is configured to be attached to the electric device, wherein the first plate and the second plate are attached to one another facing their respective first surface, wherein a first structure is arranged between the first plate and the second plate such that a channel is formed between the first plate and the second plate, and two liquid connectors in liquid communication with the channel for connecting the channel to a cooling circuit.

Abstract: A method of forming a current measurement device includes providing a glass substrate having first and second substantially planar surfaces that are opposite one another, forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces, and forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together. Forming the plurality of through-vias includes applying radiation to the glass substrate, and the conductive tracks and the through-vias collectively form a coil structure in the glass substrate.

Abstract: A method of forming a current measurement device includes providing a glass substrate having first and second substantially planar surfaces that are opposite one another, forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces, and forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together. Forming the plurality of through-vias includes applying radiation to the glass substrate, and the conductive tracks and the through-vias collectively form a coil structure in the glass substrate.